參數(shù)資料
型號(hào)： MCP3901A0-I/SS
廠商： Microchip Technology
文件頁(yè)數(shù)： 18/30頁(yè)
文件大小： 0K
描述： IC AFE 24BIT 64KSPS 20-SSOP
產(chǎn)品培訓(xùn)模塊： MCP3901 Analog Front End
標(biāo)準(zhǔn)包裝： 67
位數(shù)： 24
通道數(shù)： 2
電壓 - 電源，模擬： 4.5 V ~ 5.5 V
電壓 - 電源，數(shù)字： 2.7 V ~ 5.5 V
封裝/外殼： 20-SSOP（0.209"，5.30mm 寬）
供應(yīng)商設(shè)備封裝： 20-SSOP
包裝： 管件
產(chǎn)品目錄頁(yè)面： 677 (CN2011-ZH PDF)
其它名稱： MCP3901AO-I/SS
MCP3901AO-I/SS-ND
PCA2002
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 25 November 2011
25 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
14.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
14.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
14.3.4 Cleaning
Cleaning can be done after reflow soldering.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCP3901A0T-E/ML 功能描述:模數(shù)轉(zhuǎn)換器 - ADC Dual Ch Energy Meter Frnt End SPI I-face RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MCP3901A0T-E/SS 功能描述:模數(shù)轉(zhuǎn)換器 - ADC Dual Ch Energy Meter Fr End SPI Interface RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MCP3901A0T-I/ML 功能描述:模數(shù)轉(zhuǎn)換器 - ADC Dual CH Energy Meter Front End,SPI IF RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MCP3901A0T-I/SS 功能描述:模數(shù)轉(zhuǎn)換器 - ADC Dual CH Energy Meter Front End,SPI IF RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MCP3901A1-I/ML 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:Two Channel Analog Front End
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