參數(shù)資料
型號： MCP3901A0-I/SS
廠商： Microchip Technology
文件頁數(shù)： 16/30頁
文件大小： 0K
描述： IC AFE 24BIT 64KSPS 20-SSOP
產品培訓模塊： MCP3901 Analog Front End
標準包裝： 67
位數(shù)： 24
通道數(shù)： 2
電壓 - 電源，模擬： 4.5 V ~ 5.5 V
電壓 - 電源，數(shù)字： 2.7 V ~ 5.5 V
封裝/外殼： 20-SSOP（0.209"，5.30mm 寬）
供應商設備封裝： 20-SSOP
包裝： 管件
產品目錄頁面： 677 (CN2011-ZH PDF)
其它名稱： MCP3901AO-I/SS
MCP3901AO-I/SS-ND
PCA2002
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 25 November 2011
23 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 17) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 17.
Table 16.
PCA2002 wafer information
Type number
Wafer thickness
Wafer diameter
FFC for wafer size
Marking of bad die
PCA2002U/10AB/1
0.20 mm
6 inch
inking
PCA2002CX8/5/1
0.69 mm
6 inch
wafer mapping
PCA2002CX8/12/1
0.20 mm
6 inch
8 inch
wafer mapping
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相關代理商/技術參數(shù)
參數(shù)描述
MCP3901A0T-E/ML 功能描述:模數(shù)轉換器 - ADC Dual Ch Energy Meter Frnt End SPI I-face RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32
MCP3901A0T-E/SS 功能描述:模數(shù)轉換器 - ADC Dual Ch Energy Meter Fr End SPI Interface RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32
MCP3901A0T-I/ML 功能描述:模數(shù)轉換器 - ADC Dual CH Energy Meter Front End,SPI IF RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32
MCP3901A0T-I/SS 功能描述:模數(shù)轉換器 - ADC Dual CH Energy Meter Front End,SPI IF RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32
MCP3901A1-I/ML 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:Two Channel Analog Front End
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