
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
Freescale Semiconductor
127
4.3
Signal Contact Assignments—17 x 17 mm, 0.8 mm Pitch
×17 mm package i.MX25 signal contact assignments.
Table 101. 17×17 mm Package i.MX25 Signal Contact Assignment
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
A0
A18
EMI2
DDR
OUTPUT
Low
A1
B17
EMI2
DDR
OUTPUT
Low
A2
C17
EMI2
DDR
OUTPUT
Low
A3
B18
EMI2
DDR
OUTPUT
Low
A4
C20
EMI2
DDR
OUTPUT
Low
A5
A19
EMI2
DDR
OUTPUT
Low
A6
C19
EMI2
DDR
OUTPUT
Low
A7
B19
EMI2
DDR
OUTPUT
Low
A8
D18
EMI2
DDR
OUTPUT
Low
A9
C18
EMI2
DDR
OUTPUT
Low
A10
A2
EMI1
DDR
OUTPUT
Low
MA10
D16
EMI2
DDR
OUTPUT
Low
A11
D20
EMI2
DDR
OUTPUT
Low
A12
D17
EMI2
DDR
OUTPUT
Low
A13
D19
EMI2
DDR
OUTPUT
Low
A14
A3
EMI1
DDR
OUTPUT
Low
A15
B4
EMI1
DDR
OUTPUT
Low
A16
C6
EMI1
DDR
OUTPUT
Low
A17
B5
EMI1
DDR
OUTPUT
Low
A18
D7
EMI1
DDR
OUTPUT
Low
A19
A4
EMI1
DDR
OUTPUT
Low
A20
B6
EMI1
DDR
OUTPUT
Low
A21
C7
EMI1
DDR
OUTPUT
Low
A22
A5
EMI1
DDR
OUTPUT
Low
A23
A6
EMI1
DDR
OUTPUT
Low
A24
B7
EMI1
DDR
OUTPUT
Low
A25
A7
EMI1
DDR
OUTPUT
Low
SD0
A12
EMI1
DDR
INPUT
Keeper
SD1
C13
EMI1
DDR
INPUT
Keeper
SD2
B13
EMI1
DDR
INPUT
Keeper