參數(shù)資料
型號(hào): MCF5270AB100
廠商: 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述: Integrated Microprocessor Hardware Specification
中文描述: 集成的微處理器,硬件規(guī)格
文件頁(yè)數(shù): 10/40頁(yè)
文件大?。?/td> 863K
代理商: MCF5270AB100
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Design Recommendations
Freescale Semiconductor
10
power down or there will be undesired high current in the ESD protection diodes. There are no
requirements for the fall times of the power supplies.
The recommended power down sequence is as follows:
1. Drop V
DD
/PLLV
DD
to 0 V.
2. Drop OV
DD
supplies.
5.3
Decoupling
Place the decoupling caps as close to the pins as possible, but they can be outside the footprint of
the package.
0.1
μ
F and 0.01
μ
F at each supply input
5.4
Buffering
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See
Section 7, “Preliminary Electrical Characteristics
.”
5.5
Pull-up Recommendations
Use external pull-up resistors on unused inputs. See pin table.
5.6
Clocking Recommendations
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop currents
in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
5.7
Interface Recommendations
5.7.1
SDRAM Controller
5.7.1.1
SDRAM Controller Signals in Synchronous Mode
Table 3
shows the behavior of SDRAM signals in synchronous mode.
相關(guān)PDF資料
PDF描述
MCF5270 32-bit Embedded Controller Division
MCF5327 Microprocessor Data Sheet
MCF5372 Microprocessor Data Sheet
MCF5470 MCF547x Integrated Microprocessor Electrical Characteristics
MCF5480 MCF548x ColdFire㈢ Microprocessor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCF5270CAB100 功能描述:32位微控制器 - MCU MCF5270 V2CORE 64K SRAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF5270CVM150 功能描述:微處理器 - MPU MCF5235 V2CORE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MCF5270CVM150J 功能描述:32位微控制器 - MCU V2CORE RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF5270CVM150R2 功能描述:微處理器 - MPU MCF5270 V2CORE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MCF5270VM100 功能描述:微處理器 - MPU MCF5270 V2CORE 64KSRAM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324