參數(shù)資料
型號: MC8641DTHX1250HE
廠商: Freescale Semiconductor
文件頁數(shù): 37/130頁
文件大?。?/td> 0K
描述: IC DUAL CORE PROCESSOR 1023-CBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC86xx
處理器類型: 32-位 MPC86xx PowerPC
速度: 1.25GHz
電壓: 1.05V
安裝類型: 表面貼裝
封裝/外殼: 1023-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 1023-FCCBGA(33x33)
包裝: 托盤
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
14
Freescale Semiconductor
Power Characteristics
3
Power Characteristics
The power dissipation for the dual core MPC8641D device is shown in Table 4.
Table 4. MPC8641D Power Dissipation (Dual Core)
Power Mode
Core Frequency
(MHz)
Platform
Frequency (MHz)
VDD_Coren,
VDD_PLAT
(Volts)
Junction
Temperature
Power
(Watts)
Notes
Typical
1500 MHz
600 MHz
1.1 V
65 oC
32.1
1, 2
Thermal
105 oC
43.4
1, 3
Maximum
49.9
1, 4
Typical
1333 MHz
533 MHz
1.05 V
65 oC
23.9
1, 2
Thermal
105 oC
30.0
1, 3
Maximum
34.1
1, 4
Typical
1250 MHz
500 MHz
1.05 V
65 oC
23.9
1, 2
Thermal
105 oC
30.0
1, 3
Maximum
34.1
1, 4
Typical
1000 MHz
400 MHz
1.05 V
65 oC
23.9
1, 2
Thermal
105 oC
30.0
1, 3
Maximum
34.1
1, 4
Typical
1000 MHz
500 MHz
0.95 V,
1.05 V
65 oC
16.2
1, 2, 5
Thermal
105 oC
21.8
1, 3, 5
Maximum
25.0
1, 4, 5
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD_Coren) and 65°C junction
temperature (see Table 2)while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz with one core
at 100% efficiency and the second core at 65% efficiency.
3. Thermal power is the average power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz on both
cores and a typical workload on platform interfaces.
4. Maximum power is the maximum power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running a test which includes an entirely L1-cache-resident, contrived sequence of
instructions which keep all the execution units maximally busy on both cores.
5. These power numbers are for Part Number MC8641Dxx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V.
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