參數(shù)資料
型號： MC7457VG733NC
廠商： Freescale Semiconductor
文件頁數(shù)： 57/71頁
文件大小： 0K
描述： IC MPU RISC 733MHZ 483FCCBGA
標準包裝： 36
系列： MPC74xx
處理器類型： 32-位 MPC74xx PowerPC
速度： 733MHz
電壓： 1.1V
安裝類型： 表面貼裝
封裝/外殼： 483-BCBGA，F(xiàn)CCBGA
供應商設備封裝： 483-FCCBGA（29x29）
包裝： 托盤
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
System Design Information
Freescale Semiconductor
60
9.8
Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package
for air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see Figure 27); however, due to the potential large
mass of the heat sink, attachment through the printed-circuit board is suggested. If a spring clip is used,
the spring force should not exceed 10 pounds.
Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7457. There are
several commercially available heat sinks for the MPC7457 provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions
401-732-8100
60 Alhambra Road
Warwick, RI 02886
Internet: www.calgregthermalsolutions.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Thermal
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
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相關代理商/技術參數(shù)
參數(shù)描述
MC7457VG867NC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MC74A5-33SNTR 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel
MC74A5-50T 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel
MC74AC00 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:QUAD 2-INPUT NAND GATE
MC74AC00D 功能描述:邏輯門 2-6V Quad 2-Input RoHS:否 制造商:Texas Instruments 產品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel
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