• 參數(shù)資料
    型號(hào)： MC7457RX1000LC
    廠商： Freescale Semiconductor
    文件頁(yè)數(shù)： 57/71頁(yè)
    文件大?。?/td> 0K
    描述： IC MPU RISC 32BIT 483FCCBGA
    標(biāo)準(zhǔn)包裝： 36
    系列： MPC74xx
    處理器類(lèi)型： 32-位 MPC74xx PowerPC
    速度： 1.0GHz
    電壓： 1.3V
    安裝類(lèi)型： 表面貼裝
    封裝/外殼： 483-BCBGA，F(xiàn)CCBGA
    供應(yīng)商設(shè)備封裝： 483-FCCBGA（29x29）
    包裝： 托盤(pán)
    MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
    System Design Information
    Freescale Semiconductor
    60
    9.8
    Thermal Management Information
    This section provides thermal management information for the ceramic ball grid array (CBGA) package
    for air-cooled applications. Proper thermal control design is primarily dependent on the system-level
    design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
    sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
    or package, and mounting clip and screw assembly (see Figure 27); however, due to the potential large
    mass of the heat sink, attachment through the printed-circuit board is suggested. If a spring clip is used,
    the spring force should not exceed 10 pounds.
    Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
    The board designer can choose between several types of heat sinks to place on the MPC7457. There are
    several commercially available heat sinks for the MPC7457 provided by the following vendors:
    Aavid Thermalloy
    603-224-9988
    80 Commercial St.
    Concord, NH 03301
    Internet: www.aavidthermalloy.com
    Alpha Novatech
    408-749-7601
    473 Sapena Ct. #15
    Santa Clara, CA 95054
    Internet: www.alphanovatech.com
    Calgreg Thermal Solutions
    401-732-8100
    60 Alhambra Road
    Warwick, RI 02886
    Internet: www.calgregthermalsolutions.com
    International Electronic Research Corporation (IERC)
    818-842-7277
    413 North Moss St.
    Burbank, CA 91502
    Internet: www.ctscorp.com
    Thermal
    Heat Sink
    CBGA Package
    Heat Sink
    Clip
    Printed-Circuit Board
    Interface Material
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    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    MC7457RX1000NB 制造商:Motorola Inc 功能描述:
    MC7457RX1000NC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
    MC7457RX1200PB 制造商:Freescale Semiconductor 功能描述:A7, 1.35V +50MV/-30MV - Trays
    MC7457RX1267LB 制造商:Freescale Semiconductor 功能描述:MPC74XX RISC 32-BIT 0.13UM 1.267GHZ 1.5V/1.8V/2.5V 483-PIN F - Trays
    MC7457RX1267LC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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