
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
60
Freescale Semiconductor
Ordering Information
11 Ordering Information
Ordering information for the parts fully covered by this specification document is provided in
Section 11.1, “Part
Numbers Fully Addressed by This Document.”
Note that the individual part numbers correspond to a maximum
processor core frequency. For available frequencies, contact your local Freescale sales office. In addition to the
processor frequency, the part numbering scheme also includes an application modifier which may specify special
application conditions. Each part number also contains a revision level code which refers to the die mask revision
number.
Section 11.2, “Part Numbers Not Fully Addressed by This Document,”
lists the part numbers which do not
1.1
Removed reference to Note 4 for DTI signals in
Table 15
and
Table 16
: these signals are unused in 60x
bus mode and must be pulled down (see Note 13); they are not ignored.
Improved precision of die and package dimensions in
Figure 20
and
Figure 21
.
2
Corrected entries in
Table 17
for 33 MHz and 50 MHz bus frequencies with multipliers of 24x and higher.
Corrected typographical errors in heatsink selection example in
Section 9.8.3, “Heat Sink Selection
Example.”
Removed erroneous instances of PLL_EXT signal name and changed remaining instances of
PLL_CFG[0:3] to PLL_CFG[0:4]. (These were artifacts from older revisions; see entry for Rev 1.0.)
Corrected erroneous instances (artifacts) mentioning 1.6 V core voltage. Core voltage for devices
completely covered by this revision (and revisions 1.x)of this document is 1.3 V.
Corrected errors in PLL multipliers in
Table 17
: 32x and 25x are not supported ratios, 3x and 4x are
supported, 10.5x and 12.5x PLL settings were incorrect.
Replaced notes at bottom of
Table 17
(erroneously missing in revisions 1.x).
Updated coplanarity specifications in
Figure 20
and
Figure 21
from 0.2 mm to 0.15 mm.
3
Added Revision G (Rev 3.4) devices to specifications.
Added new PowerPC trademarking information.
4
Added substrate capacitor information in
Section 8.3, “Substrate Capacitors for the MPC7445, 360
CBGA,”
and
Section 8.6, “Substrate Capacitors for the MPC7455, 483 CBGA.”
Clarified maximum and typical L3 clock frequency in
Section 5.2.3, “L3 Clock AC Specifications”
; typical
L3 frequency now stated as 250 MHz based on changes to L3 AC timing.
Significantly changed L3 AC timing in
Table 12
and
Table 13
. These changes reflect both updates
based on latest characterization and error corrections (effects of non-zero L3OH values were incorrectly
documented in earlier revisions of this document).
Clarified address bus pull-up resistor recommendations in
Section 9.6, “Pull-Up/Pull-Down Resistor
Requirements.”
Added pull-up/pull-down recommendations for CKSTP_IN and PLL_CFG[0:4] to
Section 9.6,
“Pull-Up/Pull-Down Resistor Requirements.”
Modified
Table 9
,
Figure 5
, and
Figure 6
to more accurately show when the mode select inputs
(BMODE[0:1], L3VSEL, BVSEL) are sampled and AC timing requirements.
Figure 20
and
Figure 22
: Updated/corrected dimensions in mechanical drawings.
4.1
Document tempate update.
Table 20. Document Revision History (continued)
Rev. No.
Substantive Change(s)