參數(shù)資料
型號: MC33999
廠商: Motorola, Inc.
英文描述: 16-Output Switch with SPI and PWM Control
中文描述: 16 - SPI和輸出的PWM控制開關(guān)
文件頁數(shù): 4/16頁
文件大?。?/td> 627K
代理商: MC33999
33999
4
Go to: www.freescale.com
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
VPWR Supply Voltage (Note 1)
V
PWR
-1.5 to 50
V
SPI Interface Logic Supply Voltage (Note 1)
SO
PWR
-0.3 to 7.0
V
SPI Interface Logic Input Voltage (
CS
, PWM, SI, SO, SCLK,
RST
, PWMn)
(Note 1)
V
IN
-0.3 to 7.0
V
Output Drain Voltage
V
DS
-0.3 to 45
V
Frequency of SPI Operation (Note 2)
f
SPI
6.0
MHz
Output Clamp Energy (Note 3)
E
CLAMP
50
mJ
ESD Voltage (Note 4)
Human Body Model (Note 5)
Machine Model (Note 6)
V
ESD1
V
ESD2
±2000
±200
V
Storage Temperature
T
STG
-55 to 150
°C
Operating Case Temperature
T
C
-40 to 125
°C
Operating Junction Temperature
T
J
-40 to 150
°C
Power Dissipation (T
A
= 25°C) (Note 7)
P
D
2.0
W
Lead Soldering Temperature (Note 8)
T
SOLDER
260
°C
Thermal Resistance
Junction-to-Ambient (Note 9)
Junction-to-Case (Note 10)
Junction-to-Board
R
θ
JA
R
θ
JC
R
θ
JB
60
1.2
8.0
°C/W
Notes
1.
2.
3.
4.
5.
6.
7.
8.
Exceeding these limits may cause malfunction or permanent damage to the device.
This parameter is guaranteed by design but not production tested.
Maximum output clamp energy capability at 150
°
C junction temperature using single non-repetitive pulse method.
ESD data is available upon request.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
Maximum power dissipation with no heat sink used.
Lead soldering temperature limit is for 10 seconds maximum duration. Not designed of immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Tested per JEDEC test JESD52-2 (single-layer PWB).
Tested per JEDEC test JESD51-8 (two-layer PWB).
9.
10.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
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