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參數(shù)資料
| 型號： | MC33794 |
| 廠商： | Motorola, Inc. |
| 英文描述： | Electric Field Imaging Device |
| 中文描述： | 電場成像設(shè)備 |
| 文件頁數(shù)： | 9/20頁 |
| 文件大?。?/td> | 491K |
| 代理商： | MC33794 |
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33794
9
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Peak V
PWR
Voltage
V
PWRPK
40
V
Double Battery
1 Minute Maximum T
A
= 30
°
C
V
DBLBAT
26.5
V
ESD Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
V
ESD1
V
ESD2
±2000
±200
V
Storage Temperature
T
STG
-55 to 150
°
C
Operating Ambient Temperature
T
A
-40 to 85
°
C
Operating Junction Temperature
T
J
-40 to 150
°
C
Thermal Resistance
Junction-to-Ambient (Note 3)
Junction-to-Case (Note 4)
Junction-to-Board (Note 5)
R
θ
J-A
R
θ
J-C
R
θ
J-B
41
0.2
3.0
°
C/W
Soldering Temperature (for 10 Seconds)
T
SOLDER
260
°
C
Notes
1.
2.
3.
ESD1 performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
).
ESD2 performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-87
and JEDEC JESD51-2 with the single layer board horizontal.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883
Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
4.
5.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC33794DH | Electric Field Imaging Device |
| MC33794DWB | Electric Field Imaging Device |
| MC3392DW | LOW SIDE PROTECTED SWITCH |
| MC3392 | LOW SIDE PROTECTED SWITCH |
| MC3392T | LOW SIDE PROTECTED SWITCH |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC33794DH | 功能描述:IC SENSOR ELECTRIC FIELD 44-HSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 傳感器和探測器接口 系列:- 其它有關(guān)文件:Automotive Product Guide 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數(shù)字 輸出類型:數(shù)字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:管件 |
| MC33794DHR2 | 制造商:Rochester Electronics LLC 功能描述:OCCUPANT DETECT E-FIELD SENSOR FOR MCU SUPPORT - Bulk |
| MC33794DWB | 功能描述:IC SENSOR ELECTRIC FIELD 54-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 傳感器和探測器接口 系列:- 其它有關(guān)文件:Automotive Product Guide 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數(shù)字 輸出類型:數(shù)字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:管件 |
| MC33794DWBR2 | 功能描述:IC SENSOR ELECTRIC FIELD 54-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 傳感器和探測器接口 系列:- 其它有關(guān)文件:Automotive Product Guide 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數(shù)字 輸出類型:數(shù)字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:管件 |
| MC33794EK | 功能描述:近程傳感器 ODS 54LD RoHS:否 制造商:Vishay Semiconductors 感應(yīng)方式:Optical 感應(yīng)距離:1 mm to 200 mm 電源電壓:2.5 V to 3.6 V 安裝風(fēng)格:SMD/SMT 輸出配置:Digital 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 系列:VCNL3020 |
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