參數(shù)資料
型號: MC33794
廠商: Motorola, Inc.
英文描述: Electric Field Imaging Device
中文描述: 電場成像設(shè)備
文件頁數(shù): 17/20頁
文件大?。?/td> 491K
代理商: MC33794
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33794
17
PACKAGE DIMENSIONS
SEATING
PLANE
DATUM
BOTTOM VIEW
A
X 45
E1
22X
E
D
h
e
4
B
M
bbb
C
44
23
22
1
E2
°
D
D
E3
A2
SECTION W-W
b
c1
b1
c
E4
A
M
aaa
C
EXPOSED
HEATSINK AREA
A
B
C
H
PIN ONE ID
Y
GAUGE
PLANE
DETAIL Y
(1.600)
L
W
W
q
bbb C
L1
A
0
NOTES:
1.
2.
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
DATUM PLANE -H- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
DIMENSIONS D AND E1 DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.150 PER SIDE.
DIMENSIONS D AND E1 DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE -H-.
DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN
EXCESS OF THE b DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DATUMS -A- AND -B- TO BE DETERMINED AT
DATUM PLANE -H-.
DIMENSION D DOES NOT INCLUDE TIEBAR
PROTRUSIONS. ALLOWABLE TIEBAR
PROTRUSIONS ARE 0.150 PER SIDE.
3.
4.
5.
6.
7.
DIM
A
A1
A2
D
D1
11.700 12.600
D2
0.900
D3
---
MIN
3.000
0.025
2.900
15.800 16.000
MAX
3.400
0.125
3.100
MILLIMETERS
1.100
1.000
E
E1
10.900 11.100
E2
2.500
E3
6.400
E4
2.700
E5
---
13.950 14.450
2.700
7.300
2.900
1.000
L
L1
b
b1
c
c1
e
h
q
aaa
bbb
0.840
0.350 BSC
0.220
0.220
0.230
0.230
0.650 BSC
---
0
0.200
0.100
1.100
0.350
0.320
0.320
0.280
0.800
8
°
°
D
4
E5
4X
DH SUFFIX
44-LEAD HSOP
PLASTIC PACKAGE
CASE 1291-01
ISSUE O
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