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MC14067B
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
VDD
Test Conditions
55°C
25_C
125_C
Unit
Min
Max
Min
Max
Min
Max
SUPPLY REQUIREMENTS (Voltages Referenced to VSS)
Power Supply Voltage
Range
VDD
3.0
18
3.0
18
3.0
18
V
Quiescent Current Per
Package
IDD
5.0
10
15
Control Inputs: Vin =
VSS or VDD,
Switch I/O: VSS v VI/O v
VDD, and
5.0
10
20
0.005
0.010
0.015
5.0
10
20
150
300
600
mA
Total Supply Current
(Dynamic Plus
Quiescent,
Per Package
ID(AV)
5.0
10
15
TA = 25_C only (The
channel component,
(Vin – Vout)/Ron, is
not included.)
(0.07 mA/kHz) f + IDD
Typical
(0.20 mA/kHz) f + IDD
(0.36 mA/kHz) f + IDD
mA
CONTROL INPUTS — INHIBIT, A, B, C, D (Voltages Referenced to VSS)
LowLevel Input Voltage
VIL
5.0
10
15
Ron = per spec,
Ioff = per spec
1.5
3.0
4.0
2.25
4.50
6.75
1.5
3.0
4.0
1.5
3.0
4.0
V
HighLevel Input Voltage
VIH
5.0
10
15
Ron = per spec,
Ioff = per spec
3.5
7.0
11
3.5
7.0
11
2.75
5.50
8.25
3.5
7.0
11
V
Input Leakage Current
Iin
15
Vin = 0 or VDD
± 0.1
±0.00001 ± 0.1
1.0
mA
Input Capacitance
Cin
—
5.0
7.5
pF
SWITCHES IN/OUT AND COMMONS OUT/IN — X, Y (Voltages Referenced to VSS)
Recommended Peakto
Peak Voltage Into or
Out of the Switch
VI/O
Channel On or Off
0
VDD
0
VDD
0
VDD
Vpp
Recommended Static or
Dynamic Voltage
(Figure 1)
DVswitch
Channel On
0
600
0
600
0
300
mV
Output Offset Voltage
VOO
Vin = 0 V, No Load
10
mV
ON Resistance
Ron
5.0
10
15
Vin = VIL or VIH
(Control), and Vin
0 to VDD (Switch)
800
400
220
250
120
80
1050
500
280
1300
550
320
W
DON Resistance
Between
Any Two Channels
in the Same Package
DRon
5.0
10
15
70
50
45
25
10
70
50
45
135
95
65
W
OffChannel Leakage
Current (Figure 2)
Ioff
15
Vin = VIL or VIH
(Control) Channel to
Channel or Any One
Channel
± 100
± 0.05
±100
±1000 nA
Capacitance, Switch I/O
CI/O
Inhibit = VDD
—
10
pF
Capacitance, Common O/I
CO/I
Inhibit = VDD
(MC14067B)
(MC14097B)
100
60
pF
Capacitance, Feedthrough
(Channel Off)
CI/O
Pins Not Adjacent
Pins Adjacent
0.47
pF
2. Data labeled “Typ” is not to be used for design purposes, but is intended as an indication of the IC’s potential performance.
3. For voltage drops across the switch (DVswitch) > 600 mV ( > 300 mV at high temperature), excessive VDD current may be drawn; i.e.
the current out of the switch may contain both VDD and switch input components. The reliability of the device will be unaffected unless the
Maximum Ratings are exceeded. (See first page of this data sheet.)