CPVDD Bypass Capacitor The CPVDD" />
參數(shù)資料
型號: MAX9787ETI+
廠商: Maxim Integrated Products
文件頁數(shù): 4/15頁
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 2.2W AB 28TQFN
標(biāo)準(zhǔn)包裝: 60
類型: AB 類
輸出類型: 2 通道(立體聲)
在某負(fù)載時最大輸出功率 x 通道數(shù)量: 2.2W x 2 @ 3 歐姆
電源電壓: 4.5 V ~ 5.5 V
特點: 消除爆音,短路保護(hù)和熱保護(hù),關(guān)機(jī),音量控制
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 28-TQFN-EP(5x5)
封裝/外殼: 28-WFQFN 裸露焊盤
包裝: 管件
MAX9787
CPVDD Bypass Capacitor
The CPVDD bypass capacitor (C3) lowers the output
impedance of the power supply and reduces the
impact of the MAX9787’s charge-pump switching tran-
sients. Bypass CPVDD with C3, the same value as C1,
and place it physically close to the CPVDD and PGND
(refer to the MAX9750 Evaluation Kit for a suggested
layout).
Powering Other Circuits
from a Negative Supply
An additional benefit of the MAX9787 is the internally
generated negative supply voltage (CPVSS). CPVSS pro-
vides the negative supply for the amplifiers. It can also
be used to power other devices within a design.
Current draw from CPVSS should be limited to 5mA;
exceeding this affects the operation of the amplifier. A
typical application is a negative supply to adjust the
contrast of LCD modules.
When considering the use of CPVSS in this manner,
note that the charge-pump voltage of CPVSS is roughly
proportional to PVDD and is not a regulated voltage. The
charge-pump output impedance plot appears in the
Typical Operating Characteristics.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance, as well as route head away
from the device. Good grounding improves audio per-
formance, minimizes crosstalk between channels, and
prevents any switching noise from coupling into the
audio signal. Connect CPGND, PGND, and GND
together at a single point on the PCB. Route CPGND
and all traces that carry switching transients away from
GND, PGND, and the traces and components in the
audio signal path.
Connect all components associated with the charge
pump (C2 and C3) to the CPGND plane. Connect VSS
and CPVSS together at the device. Place the charge-
pump capacitors (C1, C2, and C3) as close to the
device as possible. Bypass PVDD with a 0.1F capaci-
tor to GND. Place the bypass capacitors as close to the
device as possible.
Use large, low-resistance output traces. As load imped-
ance decreases, the current drawn from the device out-
puts increase. At higher current, the resistance of the
output traces decrease the power delivered to the load.
For example, when compared to a 0 trace, a 100m
trace reduces the power delivered to a 4 load from
2.1W to 2W. Large output, supply, and GND traces also
improve the power dissipation of the device.
The MAX9787 thin QFN features and exposed thermal
pad on its underside. This pad lowers the package’s
thermal resistance by providing a direct heat conduc-
tion path from the die to the PCB. Connect the exposed
thermal pad to GND by using a large pad and multiple
vias to the GND plane.
2.2W Stereo Audio Power Amplifier
with Analog Volume Control
12
______________________________________________________________________________________
Chip Information
TRANSISTOR COUNT: 9591
PROCESS: BiCMOS
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