參數(shù)資料
型號(hào): MAX9787ETI+
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 2/15頁(yè)
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 2.2W AB 28TQFN
標(biāo)準(zhǔn)包裝: 60
類(lèi)型: AB 類(lèi)
輸出類(lèi)型: 2 通道(立體聲)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量: 2.2W x 2 @ 3 歐姆
電源電壓: 4.5 V ~ 5.5 V
特點(diǎn): 消除爆音,短路保護(hù)和熱保護(hù),關(guān)機(jī),音量控制
安裝類(lèi)型: 表面貼裝
供應(yīng)商設(shè)備封裝: 28-TQFN-EP(5x5)
封裝/外殼: 28-WFQFN 裸露焊盤(pán)
包裝: 管件
MAX9787
2.2W Stereo Audio Power Amplifier
with Analog Volume Control
10
______________________________________________________________________________________
Applications Information
BTL Speaker Amplifiers
The MAX9787 features speaker amplifiers designed to
drive a load differentially, a configuration referred to as
bridge-tied load (BTL). The BTL configuration (Figure 5)
offers advantages over the single-ended configuration,
where one side of the load is connected to ground.
Driving the load differentially doubles the output volt-
age compared to a single-ended amplifier under similar
conditions. Thus, the device’s differential gain is twice
the closed-loop gain of the input amplifier. The effective
gain is given by:
Substituting 2 x VOUT(P-P) into the following equation
yields four times the output power due to double the
output voltage:
Since the differential outputs are biased at midsupply,
there is no net DC voltage across the load. This elimi-
nates the need for DC-blocking capacitors required for
single-ended amplifiers. These capacitors can be large
and expensive, can consume board space, and can
degrade low-frequency performance.
Power Dissipation and Heat Sinking
Under normal operating conditions, the MAX9787 can dis-
sipate a significant amount of power. The maximum power
dissipation for each package is given in the Absolute
Maximum Ratings under Continuous Power Dissipation, or
can be calculated by the following equation:
where TJ(MAX) is +150°C, TA is the ambient temperature,
and θJA is the reciprocal of the derating factor in oC/W
as specified in the Absolute Maximum Ratings section.
For example, θJA of the TQFN package is +42oC/W. For
optimum power dissipation, the exposed paddle of the
package should be connected to the ground plane
(see the Layout and Grounding section).
For 8 applications, the worst-case power dissipation
occurs when the output power is 1.1W/channel, result-
ing in a power dissipation of about 1W. In this case, the
TQFN packages can be used without violating the max-
imum power dissipation or exceeding the thermal pro-
tection threshold.
Output Power
The increase in power delivered by the BTL configura-
tion directly results in an increase in internal power dis-
sipation over the single-ended configuration.
If the power dissipation for a given application exceeds
the maximum allowed for a given package, either
reduce VDD, increase load impedance, decrease the
ambient temperature, or add heatsinking to the device.
Large output, supply, and ground PCB traces improve
the maximum power dissipation in the package.
P
TT
DISSPKG MAX
J MAX
A
JA
()
=
θ
V
P
V
R
RMS
OUT P P
OUT
RMS
L
=
()
22
2
A
R
VD
F
IN
2
+1
VOUT(P-P)
2 x VOUT(P-P)
VOUT(P-P)
-1
Figure 5. Bridge-Tied Load Configuration
OUTPUT POWER (mW)
THD+N
(%)
125
100
75
50
25
0.01
0.1
1
10
100
1000
0.001
0
150
VDD = 5V
RL = 16
AV = 3dB
OUTPUTS IN PHASE
OUTPUTS 180° OUT OF PHASE
Figure 6. Total Harmonic Distortion Plus Noise vs. Output Power
with Inputs In/Out of Phase
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