
M
1.3W, Filterless, Stereo Class D Audio
Power Amplifier
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V
DD
to GND..............................................................................6V
V
DD
to PV
DD
..........................................................-0.3V to +0.3V
PV
DD
to PGND .........................................................................6V
GND to PGND .......................................................-0.3V to +0.3V
All Other Pins to GND.................................-0.3V to (V
DD
+ 0.3V)
Continuous Current In/Out of PV
DD
, PGND, OUT_.........
±
800mA
Continuous Input Current (all other pins)..........................
±
20mA
Duration of OUT_ Short Circuit to GND or PV
DD
........Continuous
Duration of Short Circuit Between OUT+ and OUT-......Continuous
ELECTRICAL CHARACTERISTICS
(V
DD
= PV
DD
=
SHDN
= 3.3V, GND = PGND = 0V, SYNC = 0V (FFM), gain = 6dB (GAIN1 = 0, GAIN2 = 1), R
L
connected between
OUT+ and OUT-, R
L
=
∞
, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70°C)
20-Bump UCSP (derate 10mW/°C above +70°C)...........800mW
20-Pin TSSOP (derate 11mW/°C above +70°C)...........879.1mW
24-Pin Thin QFN (derate 20.8mW/°C above +70°C)..1666.7mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +150°C
Bump Temperature (soldering) Reflow............................+235°C
Lead Temperature (soldering, 10s).................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Supply Voltage Range
V
DD
Inferred from PSRR test
V
DD
= 3.3V, per channel
V
DD
= 5V, per channel
2.5
5.5
8
10
10
V
4.5
6.3
0.1
66
1.25
40
Quiescent Current
I
DD
mA
Shutdown Current
Common-Mode Rejection Ratio
Input Bias Voltage
Turn-On Time
I
SHDN
CMRR
V
BIAS
t
ON
μA
dB
V
ms
f
IN
= 1kHz
1.125
1.375
T
A
= +25
o
C
±
10
±
30
Output Offset Voltage
V
OS
T
MIN
< T
A
< T
MAX
V
DD
= 2.5V to 5.5V, V
IN
= 0V
100mV
P-P
ripple,
V
IN
= 0V
±
55
mV
60
80
72
50
460
750
1300
2200
0.08
0.15
86
86
88.5
88.5
1100
1400
1200
±
60
f
RIPPLE
= 217Hz
f
RIPPLE
= 20kHz
Power-Supply Rejection Ratio
PSRR
dB
R
L
= 8
R
L
= 4
R
L
= 8
R
L
= 4
V
DD
= 3.3V
Output Power (Note 3)
P
OUT
THD+N = 1%,
T
A
= +25
o
C
V
DD
= 5V
mW
R
L
= 8
(P
OUT
= 300mW), f = 1kHz
R
L
= 4
(P
OUT
= 400mW), f = 1kHz
Total Harmonic Distortion Plus
Noise (Note 3)
THD+N
%
FFM
SSM
FFM
SSM
BW = 22Hz
to 22kHz
Signal-to-Noise Ratio
SNR
V
OUT
= 1V
RMS
A-weighted
dB
SYNC = GND
SYNC = unconnected
950
1200
1250
1600
Oscillator Frequency
f
OSC
SYNC = V
DD
kHz
Minimum On-Time
SYNC Frequency Lock Range
t
MIN
f
SYNC
200
ns
kHz
1000
1600