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參數(shù)資料
| 型號： | MAX9701 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | 1.3W, Filterless, Stereo Class D Audio Power Amplifier |
| 中文描述： | 1.3W、無需濾波、立體聲D類音頻功率放大器 |
| 文件頁數(shù)： | 16/21頁 |
| 文件大小： | 1322K |
| 代理商： | MAX9701 |
M
Low frequencies are summed through a two-pole low-
pass filter and sent to the MAX9700 mono speaker
amplifier. The passband gain of the lowpass filter is
unity for in-phase stereo signals,
where R1 = R2 and R3 = R1//R2. The cutoff frequency
of the lowpass filter is set by the following equation:
Supply Bypassing, Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Large traces also aid in moving
heat away from the package. Proper grounding improves
audio performance, minimizes crosstalk between chan-
nels, and prevents any switching noise from coupling into
the audio signal. Connect PGND and GND together at a
single point on the PC board. Route all traces that carry
switching transients away from GND and the traces/com-
ponents in the audio signal path.
Bypass V
DD
with 10μF to GND and PV
DD
with 0.1μF to
PGND. Place the bypass capacitors as close to the
MAX9701 as possible. Use large, low-resistance output
traces. Current drawn from the outputs increases as load
impedance decreases. High-output trace resistance
decreases the power delivered to the load. Large output,
supply, and GND traces allow more heat to move from
the MAX9701 to the air, decreasing the thermal imped-
ance of the circuit.
The MAX9701 thin QFN-EP package features an
exposed thermal pad on its underside. This pad lowers
the package’s thermal impedance by providing a
direct heat conduction path from the die to the printed
circuit board. Connect the exposed thermal pad to the
GND plane.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, refer to Application Note:
UCSP—A Wafer-Level Chip-Scale Package
available on
Maxim’s website at www.maxim-ic.com/ucsp.
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C
R
R
=
×
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2
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1
2
3
4
R
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1.3W, Filterless, Stereo Class D Audio
Power Amplifier
16
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PDF描述 |
|---|---|
| MAX9708 | 20W/40W, Filterless, Spread-Spectrum, Mono/Stereo, Class D Amplifier |
| MAX9708ECB | 20W/40W, Filterless, Spread-Spectrum, Mono/Stereo, Class D Amplifier |
| MAX9708ETN | 20W/40W, Filterless, Spread-Spectrum, Mono/Stereo, Class D Amplifier |
| MAX9712 | 500mW. Low EMI. Filterless. Class D Audio Amplifier |
| MAX9713 | 6W. Filterless. Spread-Spectrum Mono/Stereo Class D Amplifiers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX9701EBP | 制造商:Maxim Integrated Products 功能描述:1.3W FILTERLESS STEREO CLASS D AU - Rail/Tube |
| MAX9701EBP+ | 制造商:Maxim Integrated Products 功能描述:AUD AMP SPKR 2CH STEREO 2.2W CLS-D 20UCSP - Rail/Tube |
| MAX9701EBP+T | 制造商:Maxim Integrated Products 功能描述:AUD AMP SPKR 2CH STEREO 2.2W CLS-D 20UCSP - Tape and Reel |
| MAX9701EBP+TG45 | 功能描述:音頻放大器 1.3W Filterless Class D Audio Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9701EBP-T | 制造商:Maxim Integrated Products 功能描述:1.3W, FILTERLESS, STEREO CLASS D AUDIO POWER - Tape and Reel |
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