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參數(shù)資料
| 型號： | MAX9643UATA+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 5/12頁 |
| 文件大小： | 0K |
| 描述： | IC AMP CURR SENSE 60V HS 8-TDFN |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 放大器類型： | 電流檢測 |
| 電路數(shù)： | 1 |
| 轉換速率： | 12 V/µs |
| 增益帶寬積： | 10MHz |
| 電流 - 輸入偏壓： | 35µA |
| 電壓 - 輸入偏移： | 10µV |
| 電流 - 電源： | 1mA |
| 電流 - 輸出 / 通道： | 3.4A |
| 電壓 - 電源，單路/雙路(±)： | 2.7 V ~ 36 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WFDFN 裸露焊盤 |
| 供應商設備封裝： | 8-TDFN-EP（2x3） |
| 包裝： | 帶卷 (TR) |
MAX9643
60V High-Speed Precision Current-Sense Amplifier
2
Maxim Integrated
RS+ to GND, RS- to GND (Note 1) .......................-3.5V to +65V
RS+ to RS-.......................................................................... Q15V
VCC to GND...........................................................-0.3V to +40V
VCC > 4.5V
OUT to GND .....................................................-0.3V to +4.5V
VEE to GND .........................................................+0.3V to -5V
CP1 to GND......................................................-0.3V to +4.5V
VCC ≤ 4.5V
OUT to GND ......................................... -0.3V to (VCC + 0.3V)
VEE to GND ........................................ +0.3V to (-VCC + 0.3V)
CP1 to GND.......................................... -0.3V to (VCC + 0.3V)
CP2 to GND ............................................. (VEE - 0.3V) to +0.3V
Short-Circuit Duration................................................Continuous
Continuous Input Current into Any Pin............................ Q20mA
ESD on RS+, RS- .......................................................Q4kV HBM
ESD on All Other Pins ................................................Q2kV HBM
Maximum Power Dissipation
TDFN-EP (derate 16.7mW/NC at +70NC) ................1333.3mW
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Lead Temperature (10s, soldering) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TDFN
Junction-to-Ambient Thermal Resistance (BJA)......... 60NC/W
Junction-to-Case Thermal Resistance (BJC) .............. 11NC/W
ABSOLUTE MAXIMUM RATINGS
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
ELECTRICAL CHARACTERISTICS
(VCC = 5V, VRS+ = VRS- = 12V, TA = -40NC to +125NC, unless otherwise noted.) (Note 3)
Note 1: Voltages below -3.5V are allowed, as long as the input current is limited to 5mA by an external resistor.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Input Common-Mode Voltage
Range
VRS+, VRS-
VCC R 5V, guaranteed by CMRR test,
VSENSE P 100mV
-1.5
+60
V
VCC < 5V, guaranteed by CMRR test,
VSENSE P 100mV
3.5 -
VCC
60
Input Offset Voltage (Notes 4, 5)
VOS
TA = +25NC
10
130
F
V
-40NC < TA <+125NC
650
+10NC < TA <+85NC
400
Common-Mode Rejection Ratio
(Note 5)
CMRR
-1.5V P VCM P 60V, TA = +25NC
120
130
dB
-1.5V P VCM P 60V, -40NC P TA P +125NC
110
CMRR vs. Frequency (Note 5)
AC CMRR f = 100kHz
90
dB
Input Bias Current
IRS+, IRS-
TA = +25NC
35
60
F
A
-40NC < TA < +125NC
60
Input Bias Current, VCC = 0V,
VRS+ = VRS- = 60V
IRS+, IRS
25
F
A
Input Offset Current (Note 6)
IRS+ - IRS-
TA = +25NC
0.02
0.65
F
A
+10NC < TA <+85NC
0.65
-40NC < TA < +125NC
0.8
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