M
Dual Step-Down DC-DC Power-Management ICs
for Portable Devices
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
PWRON, IN1, IN2, IN3,
RESET
, FB1, FB2,
ENDR, REFBP, SEL1, SEL2 to GND..................-0.3V to +6.0V
EN2
, EN3, EN4, DR to GND.......................-0.3V to (V
IN3
+ 0.3V)
OUT1, OUT2, OUT3, OUT4 to GND...........-0.3V to (V
IN2
+ 0.3V)
PGND1, PGND2 to GND......................................-0.3V to + 0.3V
LX1, LX2 Current..........................................................±1.5A
RMS
LX1, LX2 to GND (Note 1) ..........................-0.3V to (V
+ 0.3V)
DR Current......................................................................0.5A
RMS
ELECTRICAL CHARACTERISTICS
(V
IN
= 3.7V, C
IN1
= 10μF, C
IN2
= C
IN3
= 4.7μF, C
OUT1
= C
OUT2
= 4.7μF, C
OUT3
= C
OUT4
= 2.2μF, C
REFBP
= 0.01μF, T
A
= -40°C to
+85°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1:
LX_ has internal clamp diodes to GND and IN1. Applications that forward-bias these diodes should take care not to exceed
the IC’s package dissipation limits.
Continuous Power Dissipation (T
A
= +70°C)
24-Pin 4mm x 4mm Thin QFN
(derate 27.8mW/°C above +70°C)..........................2222.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
PARAMETER
CONDITIONS
MIN
2.6
TYP
MAX
5.5
15
UNIT
V
μA
Input Supply Range
Shutdown Supply Current
After startup
V
IN
= 4.2V (Note 3)
V
IN
= 3.7V; BUCK1, BUCK2, OUT1, OUT2 on; other
circuits off
2
160
300
No-Load Supply Current
VIN = 3.7V, BUCK1 and BUCK2 on, all LDOs on
V
IN
= 3.7V, BUCK1 and BUCK2 with 500μA load each,
OUT1 and OUT2 on, other circuits off
275
μA
Light-Load Supply Current
710
μA
UNDERVOLTAGE LOCKOUT
V
IN
rising
V
IN
falling
2.70
2.85
2.35
3.05
2.55
Undervoltage Lockout (Note 4)
V
THERMAL SHUTDOWN
Threshold
Hysteresis
REFERENCE
T
A
rising
+160
15
°C
°C
Reference Bypass Output
Voltage
T
A
= 0°C to +85°C
1.235
1.250
1.265
V
REF Supply Rejection
LOGIC AND CONTROL INPUTS
Input Low Level
2.6V
≤
V
IN
≤
5.5V
0.2
mV/V
PWRON,
EN2
, EN3, EN4; 2.6V
≤
V
IN
≤
5.5V
PWRON,
EN2
, EN3, EN4; 2.6V
≤
V
IN
≤
4.2V
PWRON,
EN2
, EN3, EN4; 2.6V
≤
V
IN
≤
5.5V
EN3, EN4; 0V < V
IN
< 5.5V
SEL_
0.4
V
1.44
1.12
1.25
Input High Level
V
Logic Input Current
Tristate Low Input Threshold
-1
0.3
+1
1.0
μA
V
0.7
Tristate Low Input Threshold
Hysteresis
SEL_
50
mV
Tristate High Input Threshold
SEL_
V
IN
-
1.2V
V
IN
-
0.8V
V
IN
-
0.4V
V