參數(shù)資料
型號(hào): MAX6403BS__-T
廠(chǎng)商: Maxim Integrated Products, Inc.
英文描述: レP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
中文描述: レP監(jiān)控電路,4焊球(2 × 2)芯片級(jí)封裝
文件頁(yè)數(shù): 8/9頁(yè)
文件大?。?/td> 137K
代理商: MAX6403BS__-T
PARTS
TOP MARK
AAJ
AAI
AAH
AAG
AAF
AAE
AAD
AAC
AAB
AAA
PARTS
TOP MARK
ABV
ABU
ABT
ABS
ABR
ABQ
ABP
ABO
ABN
ABM
PARTS
TOP MARK
ACF
ACE
ACD
ACC
ACB
ACA
ABZ
ABY
ABX
ABW
MAX6400
BS31-T
MAX6400BS30-T
MAX6400BS29-T
MAX6400BS28-T
MAX6400BS27-T
MAX6400BS26-T
MAX6400BS25-T
MAX6400BS24-T
MAX6400BS23-T
MAX6400BS22-T
MAX6401
BS31-T
MAX6401BS30-T
MAX6401BS29-T
MAX6401BS28-T
MAX6401BS27-T
MAX6401BS26-T
MAX6401BS25-T
MAX6401BS24-T
MAX6401BS23-T
MAX6401BS22-T
MAX6402
BS31-T
MAX6402BS30-T
MAX6402BS29-T
MAX6402BS28-T
MAX6402BS27-T
MAX6402BS26-T
MAX6402BS25-T
MAX6402BS24-T
MAX6402BS23-T
MAX6402BS22-T
PARTS
TOP MARK
ACT
ACS
ACR
ACQ
ACP
ACO
ACN
ACM
ACL
ACK
ACJ
ACI
ACH
ACG
PARTS
TOP MARK
ADH
ADG
ADF
ADE
ADD
ADC
ADB
ADA
ACZ
ACY
ACX
ACW
ACV
ACU
PARTS
TOP MARK
ADV
ADU
ADT
ADS
ADR
ADQ
ADP
ADO
ADN
ADM
ADL
ADK
ADJ
ADI
MAX6403
BS46-T
MAX6403BS45-T
MAX6403BS44-T
MAX6403BS43-T
MAX6403BS42-T
MAX6403BS41-T
MAX6403BS40-T
MAX6403BS39-T
MAX6403BS38-T
MAX6403BS37-T
MAX6403BS36-T
MAX6403BS35-T
MAX6403BS34-T
MAX6403BS33-T
MAX6404
BS46-T
MAX6404BS45-T
MAX6404BS44-T
MAX6404BS43-T
MAX6404BS42-T
MAX6404BS41-T
MAX6404BS40-T
MAX6404BS39-T
MAX6404BS38-T
MAX6404BS37-T
MAX6404BS36-T
MAX6404BS35-T
MAX6404BS34-T
MAX6404BS33-T
MAX6405
BS46-T
MAX6405BS45-T
MAX6405BS44-T
MAX6405BS43-T
MAX6405BS42-T
MAX6405BS41-T
MAX6405BS40-T
MAX6405BS39-T
MAX6405BS38-T
MAX6405BS37-T
MAX6405BS36-T
MAX6405BS35-T
MAX6405BS34-T
MAX6405BS33-T
Table 2. Device Marking Codes
M
μP Supervisory Circuits in 4-Bump (2
2)
Chip-Scale Package
8
_______________________________________________________________________________________
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliabil-
ity tests. CSP reliability is integrally linked to the user
s
assembly methods, circuit board material, and usage
environment. The user should closely review these areas
when considering use of a CSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as it is primarily determined by
the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user
s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Information on Maxim
s qualification plan, test data, and
recommendations are detailed in the UCSP application
note, which can be found on Maxim
s website at
www.maxim-ic.com.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MAX6404BS33 制造商:Maxim Integrated Products 功能描述:MICROPROCESSOR SUPERVISORY CIRCUITS - Rail/Tube
MAX6404BS33+ 制造商:Maxim Integrated Products 功能描述:PROCESSOR SUPERVISOR 3.3V 1UA 4UCSP - Rail/Tube
MAX6404BS33+T 功能描述:監(jiān)控電路 uPower Supervisor RoHS:否 制造商:STMicroelectronics 監(jiān)測(cè)電壓數(shù): 監(jiān)測(cè)電壓: 欠電壓閾值: 過(guò)電壓閾值: 輸出類(lèi)型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開(kāi)關(guān):No Backup 上電復(fù)位延遲(典型值):10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel
MAX6404BS33-T 功能描述:監(jiān)控電路 RoHS:否 制造商:STMicroelectronics 監(jiān)測(cè)電壓數(shù): 監(jiān)測(cè)電壓: 欠電壓閾值: 過(guò)電壓閾值: 輸出類(lèi)型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開(kāi)關(guān):No Backup 上電復(fù)位延遲(典型值):10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel
MAX6404BS34 制造商:Maxim Integrated Products 功能描述:MICROPROCESSOR SUPERVISORY CIRCUITS - Rail/Tube