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參數(shù)資料
| 型號(hào)： | MAX5874EGK+D |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 6/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 14BIT 200MSPS DUAL 68-QFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 30 |
| 設(shè)置時(shí)間： | 14ns |
| 位數(shù)： | 14 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 300mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 68-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 68-QFN 裸露焊盤（10x10） |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 4 電流，單極 |
| 采樣率（每秒）： | 200M |
| 產(chǎn)品目錄頁面： | 1398 (CN2011-ZH PDF) |
MAX5874
14-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
14
______________________________________________________________________________________
optimizing the DAC’s dynamic performance. Keep digi-
tal signal paths short and run lengths matched to avoid
propagation delay and data skew mismatches.
The MAX5874 requires five separate power-supply
inputs for analog (AVDD1.8 and AVDD3.3), digital
(DVDD1.8 and DVDD3.3), and clock (AVCLK) circuitry.
Decouple each AVDD, DVDD, and AVCLK input pin with
a separate 0.1F capacitor as close to the device as
possible with the shortest possible connection to the
ground plane (Figure 8). Minimize the analog and digi-
tal load capacitances for optimized operation.
Decouple all three power-supply voltages at the point
they enter the PCB with tantalum or electrolytic capaci-
tors. Ferrite beads with additional decoupling capaci-
tors forming a pi-network could also improve
performance.
The analog and digital power-supply inputs AVDD3.3,
AVCLK, and DVDD3.3 allow a 3.135V to 3.465V supply
voltage range. The analog and digital power-supply
inputs AVDD1.8 and DVDD1.8 allow a 1.71V to 1.89V
supply voltage range.
The MAX5874 is packaged in a 68-pin QFN-EP pack-
age, providing greater design flexibility and optimized
DAC AC performance. The EP enables the use of nec-
essary grounding techniques to ensure highest perfor-
mance operation. Thermal efficiency is not the key
factor, since the MAX5874 features low-power opera-
tion. The exposed pad ensures a solid ground connec-
tion between the DAC and the PCB’s ground layer.
The data converter die attaches to an EP lead frame
with the back of this frame exposed at the package
bottom surface, facing the PCB side of the package.
This allows for a solid attachment of the package to the
PCB with standard infrared (IR) reflow soldering tech-
niques. A specially created land pattern on the PCB,
matching the size of the EP (6mm x 6mm), ensures the
proper attachment and grounding of the DAC. Refer to
the MAX5874 EV kit data sheet. Designing vias into the
land area and implementing large ground planes in the
PCB design allow for the highest performance opera-
tion of the DAC. Use an array of at least 4 x 4 vias
(≤ 0.3mm diameter per via hole and 1.2mm pitch
between via holes) for this 68-pin QFN-EP package.
Connect the MAX5874 exposed paddle to GND. Vias
connect the land pattern to internal or external copper
planes. Use as many vias as possible to the ground
plane to minimize inductance.
MAX5874
14
OUTIP/OUTQP
OUTIN/OUTQN
DATA13–DATA0
GND
25
50
25
OUTP
OUTN
Figure 7. Differential Output Configuration
MAX5874
14
OUTIP/OUTQP
OUTIN/OUTQN
DATA13–DATA0
0.1F
AVDD1.8
DVDD1.8
0.1F
AVDD3.3
DVDD3.3
0.1F
AVCLK
BYPASSING—DAC LEVEL
*BYPASS EACH POWER-SUPPLY PIN INDIVIDUALLY.
Figure 8. Recommended Power-Supply Decoupling and
Bypassing Circuitry
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX5874EGK-TD | 功能描述:數(shù)模轉(zhuǎn)換器- DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5874EVKIT | 功能描述:數(shù)模轉(zhuǎn)換器- DAC Evaluation Kit for the MAX5873 MAX5874 MAX5875 RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5875EGK | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX5875EGK+D | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 16-Bit 2Ch 200Msps DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5875EGK+TD | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 16-Bit 2Ch 200Msps DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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