參數(shù)資料
型號: MAX5592EUG
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: DAC
英文描述: Buffered, Fast-Settling, Octal, 12/10/8-Bit, Voltage-Output DACs
中文描述: PARALLEL, WORD INPUT LOADING, 3 us SETTLING TIME, 10-BIT DAC, PDSO24
封裝: 4.40 MM, MO-153AD, TSSOP-24
文件頁數(shù): 31/33頁
文件大小: 1114K
代理商: MAX5592EUG
M
Buffered, Fast-Settling, Octal, 12/10/8-Bit,
Voltage-Output DACs
______________________________________________________________________________________
31
Power-Supply and Layout Considerations
Bypass the analog and digital power supplies by using a
10μF capacitor in parallel with a 0.1μF capacitor to AGND
and DGND (Figure 10). Minimize lead lengths to reduce
lead inductance. Use shielding and/or ferrite beads to fur-
ther increase isolation.
Digital and AC transient signals coupling to AGND can
create noise at the output. Connect AGND to the high-
est quality ground available. Use proper grounding
techniques, such as a multilayer board with a low-
inductance ground plane. Wire-wrapped boards and
sockets are not recommended. For optimum system
performance, use PC boards with separate analog and
digital ground planes. Connect the two ground planes
together at the low-impedance power-supply source.
Using separate power supplies for AV
DD
and DV
DD
improves noise immunity. Connect AGND and DGND at
the low-impedance power-supply sources (Figure 11).
MAX5590–MAX5595
V
REF
10
μ
F*
0.1
μ
F*
REF
SCLK
DIN
PU
UPIO1
UPIO2
CS
DSP
AGND**
DGND**
OUTA
FBA
FBH
OUTH
MAX5591
MAX5593
MAX5595
ONLY
10
μ
F
0.1
μ
F
10
μ
F
0.1
μ
F
DV
DD
AV
DD
DV
DD
AV
DD
*REMOVE BYPASS CAPACITORS ON REF FOR AC-REFERENCE INPUTS.
**CONNECT ANALOG AND DIGITAL GROUND PLANES AT THE
LOW-IMPEDANCE POWER-SUPPLY SOURCE.
Figure 10. Bypassing Power Supplies AV
DD
, DV
DD
, and REF
MAX5590–MAX5595
0.1
μ
F
10
μ
F
AV
DD
AGND
AV
DD
AGND
0.1
μ
F
10
μ
F
DV
DD
DGND
DV
DD
DGND
DV
DD
DGND
ANALOG SUPPLY
DIGITAL SUPPLY
DIGITAL
CIRCUITRY
Figure 11. Separate Analog and Digital Power Supplies
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