參數(shù)資料
型號(hào)： MAX3301EETJ
廠商： MAXIM INTEGRATED PRODUCTS INC
元件分類： 通用總線功能
英文描述： CLAMP
中文描述： LINE TRANSCEIVER, QCC32
封裝： 5 X 5 MM, 0.8 MM HEIGHT, MO-220/WHHD-2, TQFN-32
文件頁(yè)數(shù)： 28/33頁(yè)
文件大?。?/td> 935K
代理商： MAX3301EETJ
M
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Human Body Model
Figure 22 shows the Human Body Model and Figure 23
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5k
resistor.
IEC 61000-4-2
The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3301E helps
the user design equipment that meets level 3 of IEC
61000-4-2, without the need for additional ESD-protec-
tion components. The major difference between tests
done using the Human Body Model and 6IEC 1000-4-2
is a higher peak current in IEC 61000-4-2, due to the
fact that series resistance is lower in the IEC 61000-4-2
model. Hence, the ESD-withstand voltage measured to
IEC 61000-4-2 is generally lower than that measured
using the Human Body Model. Figure 24 shows the IEC
61000-4-2 model. The Air-Gap Discharge test involves
approaching the device with a charged probe. The con-
tact discharge method connects the probe to the device
before the probe is energized. Figure 25 shows the IEC
61000-4-2 current waveform.
Layout Considerations
The MAX3301E high operating frequency makes proper
layout important to ensure stability and maintain the out-
put voltage under all loads. For best performance, mini-
mize the distance between the bypass capacitors and
the MAX3301E. Use symmetric trace geometry from D+
and D- to the USB connector.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and the recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to the Application Note:
UCSP—A Wafer-Level Chip-Scale Package
available on
Maxim’s website at www.maxim-ic.com/ucsp.
Chip Information
TRANSISTOR COUNT: 10,004
PROCESS: BiCMOS
USB On-the-Go Transceiver and Charge Pump
28
______________________________________________________________________________________
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
R
C
50M
to 100M
R
D
330
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 24. IEC 61000-4-2 ESD Test Model
I
100%
90%
10%
t
R
= 0.7ns TO 1ns
I
P
60ns
30ns
t
Figure 25. IEC 61000-4-2 Current Waveform
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MAX3301EETJ+ 功能描述:USB 接口集成電路 USB On-the-Go Tcvr & Charge Pump RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
MAX3301EETJ+GH7 功能描述:USB 接口集成電路 USB On-the-Go Transceiver and Charge Pump RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
MAX3301EETJ+T 功能描述:USB 接口集成電路 USB On-the-Go Tcvr & Charge Pump RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
MAX3301EETJ+TGH7 功能描述:USB 接口集成電路 USB On-the-Go Transceivers and Charge Pumps RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
MAX3301EETJ-T 功能描述:USB 接口集成電路 RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
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