參數(shù)資料
型號(hào)： MAX3301EETJ
廠商： MAXIM INTEGRATED PRODUCTS INC
元件分類(lèi)： 通用總線功能
英文描述： CLAMP
中文描述： LINE TRANSCEIVER, QCC32
封裝： 5 X 5 MM, 0.8 MM HEIGHT, MO-220/WHHD-2, TQFN-32
文件頁(yè)數(shù)： 2/33頁(yè)
文件大?。?/td> 935K
代理商： MAX3301EETJ
M
USB On-the-Go Transceiver and Charge Pump
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
All voltages are referenced to GND.
V
CC
, V
L
.....................................................................-0.3V to +6V
TRM (regulator off or supplied by V
BUS
)..-0.3V to (V
BUS
+ 0.3V)
TRM (regulator supplied by V
CC
)...............-0.3V to (V
CC
+ 0.3V)
D+, D- (transmitter tri-stated)...................................-0.3V to +6V
D+, D- (transmitter functional)....................-0.3V to (V
CC
+ 0.3V)
V
BUS
.........................................................................-0.3V to +6V
ID_IN, SCL, SDA.......................................................-0.3V to +6V
INT
, SPD,
RESET
, ADD,
OE/INT
, RCV, VP,
VM, SUS, DAT_VP, SE0_VM ......................-0.3V to (V
L
+ 0.3V)
C+.............................................................-0.3V to (V
BUS
+ 0.3V)
C-................................................................-0.3V to (V
CC
+ 0.3V)
Short-Circuit Duration, V
BUS
to GND .........................Continuous
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +3V to +4.5V, V
L
= +1.65V to +3.6V, C
FLYING
= 100nF, C
VBUS
= 1μF, ESR
CVBUS
= 0.1
(max), T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at V
CC
= +3.7V, V
L
= +2.5V, T
A
= +25°C.) (Note 2)
Note 1:
The UCSP package is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the
device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is
required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70°C)
5 x 5 UCSP (derate 12.2mW/°C above +70°C) ...........976mW
32-Pin Thin QFN (5mm x 5mm x 0.8mm) (derate 21.3mW/°C
above +70°C).............................................................1702mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Bump Reflow Temperature (Note 1)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C
PARAMETER
SYM B O L
V
CC
V
TRM
V
L
I
VL
CONDITIONS
MIN
3.0
3.0
1.65
TYP
MAX
4.5
3.6
3.60
5
UNITS
V
V
V
μA
Supply Voltage
TRM Output Voltage
Logic Supply Voltage
V
L
Supply Current
I
2
C interface in steady state
V
CC
Operating Supply Current
I
CC
USB normal mode, C
L
= 50pF, device
switching at full speed
10
mA
vbus_drv = 1, I
VBUS
= 0
vbus_drv = 0, D+ = high, D- = low
1.4
0.5
3.5
2
V
CC
Supply Current During Full-
Speed Idle
0.8
10
mA
V
CC
Shutdown Supply Current
V
CC
Interrupt Shutdown Supply
Current
I
CC(SHDN)
μA
I
CC(ISHDN)
ID_IN floating or high
20
30
μA
V
CC
Suspend Supply Current
LOGIC I/O
USB suspend mode, ID_IN floating or high
170
500
μA
RC V D AT_V P S E 0_V M
INT
,
OE
/
INT
, V P V M Outp ut H g h
V ol ag e
V
OH
I
OUT
= 1mA (sourcing)
V
L
- 0.4
V
RCV, DAT_VP, SE0_VM,
INT
,
OE
/
INT
, VP, VM Output Low
Voltage
V
OL
I
OUT
= 1mA (sinking)
0.4
V
OE
/
INT
, SPD, SUS,
RESET
,
DAT_VP, SE0_VM Input High
Voltage
V
IH
2/3 x V
L
V
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MAX3301EETJ+ 功能描述:USB 接口集成電路 USB On-the-Go Tcvr & Charge Pump RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
MAX3301EETJ+GH7 功能描述:USB 接口集成電路 USB On-the-Go Transceiver and Charge Pump RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
MAX3301EETJ+T 功能描述:USB 接口集成電路 USB On-the-Go Tcvr & Charge Pump RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
MAX3301EETJ+TGH7 功能描述:USB 接口集成電路 USB On-the-Go Transceivers and Charge Pumps RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
MAX3301EETJ-T 功能描述:USB 接口集成電路 RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
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