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參數(shù)資料
| 型號： | MAX2055EUP |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | RELIABILITY REPORT FOR MAX2055EUP PLASTIC ENCAPSULATED DEVICES |
| 中文描述： | 可靠性報告的MAX2055EUP塑封器件 |
| 文件頁數(shù)： | 12/13頁 |
| 文件大?。?/td> | 805K |
| 代理商： | MAX2055EUP |
M
package. This pad should be connected to the ground
plane of the board by using multiple vias under the
device to provide the best RF/thermal conduction path.
Solder the exposed pad on the bottom of the device
package to a PC board exposed pad.
The MAX2055 Evaluation Kit can be used as a refer-
ence for board layout. Gerber files are available upon
request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
CC
pin with a
1000pF and 100pF capacitor. Connect the 100pF
capacitor as close to the device as possible. Resistor
R7 helps reduce switching transients. If switching tran-
sients are not a concern, R7 is not required. Therefore,
connect pin 9 directly to V
CC
.
Exposed Paddle RF Thermal
Considerations
The EP of the MAX2055
’
s 20-pin TSSOP-EP package
provides a low thermal-resistance path to the die. It is
important that the PC board on which the IC is mounted
be designed to conduct heat from this contact. In addi-
tion, the EP provides a low-inductance RF ground path
for the device.
It is recommended that the EP be soldered to a ground
plane on the PC board, either directly or through an
array of plated via holes.
Soldering the pad to ground is also critical for efficient
heat transfer. Use a solid ground plane wherever
possible.
Digitally Controlled, Variable-Gain, Differential
ADC Driver/Amplifier
12
______________________________________________________________________________________
ATTENUATION
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
B4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
B3*
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
B2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
B1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
B0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Table 3. Attenuation Setting vs. Gain-
Control Bits
*
Enabling B4 disables B3 and the minimum attenuation is
16dB.
Chip Information
TRANSISTOR COUNT: 325
PROCESS: BiCMOS
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PDF描述 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX2055EUP+ | 制造商:Maxim Integrated Products 功能描述:ADC DRVR/AMP 20TSSOP EP - Rail/Tube |
| MAX2055EUP+D | 功能描述:射頻混合器 Variable-Gain Diff ADC Driver/Amp RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX2055EUP+T | 制造商:Maxim Integrated Products 功能描述:ADC DRVR/AMP 20TSSOP EP - Tape and Reel |
| MAX2055EUP+TD | 功能描述:射頻混合器 Variable-Gain Diff ADC Driver/Amp RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX2055EUP-D | 功能描述:射頻放大器 RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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