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參數(shù)資料
| 型號(hào)： | MAX1854 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | High-Speed, Adjustable, Synchronous Step-Down Controllers with Integrated Voltage Positioning |
| 中文描述： | 高速、數(shù)字可調(diào)、同步降壓型控制器，集成電壓定位電路 |
| 文件頁數(shù)： | 29/33頁 |
| 文件大?。?/td> | 840K |
| 代理商： | MAX1854 |
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M
High-Speed, Adjustable, Synchronous Step-Down
Controllers with Integrated Voltage Positioning
______________________________________________________________________________________
29
V
CC
, REF, and CC capacitors, as well as the resis-
tive-dividers connected to FB and ILIM.
3) Keep the power traces and load connections short.
This is essential for high efficiency. The use of thick
copper PC boards (2oz vs. 1oz) can enhance full-
load efficiency by 1% or more. Correctly routing PC
board traces is a difficult task that must be
approached in terms of fractions of centimeters,
where a single m
of excess trace resistance caus-
es a measurable efficiency penalty.
4) CS and PGND connections for current limiting must
be made using Kelvin sense connections to guaran-
tee the current-limit accuracy.
5) When trade-offs in trace lengths must be made, it
’
s
preferable to allow the inductor charging path to be
made longer than the discharge path. For example,
it
’
s better to allow some extra distance between the
input capacitors and the high-side MOSFET than to
allow distance between the inductor and the low-side
MOSFET or between the inductor and the output filter
capacitor.
6) Ensure the FB connection to the output is short and
direct.
7) Route high-speed switching nodes away from sensi-
tive analog areas (CC, REF, ILIM). Make all pin-strap
control input connections (SKIP,
SHDN
, ILIM, etc.) to
analog ground or V
CC
rather than PGND or V
DD
.
Layout Procedure
1)Place the power components first, with ground termi-
nals adjacent (low-side MOSFET source, C
IN
, C
OUT
,
and D1 anode). If possible, make all these connec-
tions on the top layer with wide, copper-filled areas.
2)Mount the controller IC adjacent to the low-side
MOSFET. The DL gate trace must be short and wide,
measuring 10 to 20 squares (50mils to 100mils wide
if the MOSFET is 1 inch from the controller IC).
D1
D1
VIA TO V+
VIA TO LX
VIA TO FB
VIA TO
SOURCE
OF Q2
VIA TO GND
NEAR R
SENSE
VIA TO CS
AND VPS
INDUCTOR DISCHARGE PATH HAS LOW DC RESISTANCE.
V
DD
ALL ANALOG GROUNDS
CONNECT TO LOCAL PLANE ONLY
NOTES:
"STAR" GROUND IS USED.
D1 IS DIRECTLY ACROSS Q2.
CONNECT LOCAL ANALOG GROUND PLANE DIRECTLY TO GND FROM
THE SIDE OPPOSITE THE V
DD
CAPACITOR GND TO AVOID V
DD
GROUND
CURRENTS FROM FLOWING IN THE ANALOG GROUND PLANE.
MAX1717
BATTERY
INPUT
L1
V
OUT
Q2
Q1
R
SENSE
GND
INPUT
GND
OUTPUT
GND
V
CC
CC
REF
C
OUT
C
IN
Figure 10. Power-Stage PC Board Layout Example
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX1854EEG | 功能描述:DC/DC 開關(guān)控制器 RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| MAX1854EEG/GG8 | 功能描述:DC/DC 開關(guān)控制器 High-Speed Adjustable Synchronous Step-Down Controllers with Integrated Voltage Positioning RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| MAX1854EEG+ | 制造商:Maxim Integrated Products 功能描述:HIGH-SPEED,DIGITALLY ADJUSTABLE SYNCHRONOUS STEPDOWN CONTROL - Rail/Tube |
| MAX1854EEG+T | 制造商: 功能描述: 制造商:undefined 功能描述: |
| MAX1854EEGT | 制造商: 功能描述: |
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