參數(shù)資料
型號(hào)： LTC3835IUFD
廠商： LINEAR TECHNOLOGY CORP
元件分類： 穩(wěn)壓器
英文描述： 3 A SWITCHING CONTROLLER, 580 kHz SWITCHING FREQ-MAX, PQCC20
封裝： 4 X 5 MM, PLASTIC, MO-220, QFN-20
文件頁(yè)數(shù)： 16/30頁(yè)
文件大小： 1775K
代理商： LTC3835IUFD
LTC3835
23
3835fd
APPLICATIONS INFORMATION
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. These items are also illustrated graphically in the
layout diagram of Figure 9. The Figure 10 illustrates the
current waveforms present in the various branches of the
synchronous regulator operating in the continuous mode.
Check the following in your layout:
1. Is the top N-channel MOSFET M1 located within 1cm
of CIN?
2. Are the signal and power grounds kept separate? The
combined IC signal ground pin and the ground return
of CINTVCC must return to the combined COUT (–) ter-
minals. The path formed by the top N-channel MOSFET,
Schottky diode and the CIN capacitor should have short
leads and PC trace lengths. The output capacitor (–)
terminals should be connected as close as possible
to the (–) terminals of the input capacitor by placing
the capacitors next to each other and away from the
Schottky loop described above.
3. Does the LTC3835 VFB pin resistive divider connect to the
(+) terminals of COUT? The resistive divider must be con-
nectedbetweenthe(+)terminalofCOUTandsignalground.
Thefeedbackresistorconnectionsshouldnotbealongthe
high current input feeds from the input capacitor(s).
4. Are the SENSE– and SENSE+ leads routed together with
minimumPCtracespacing?Thefiltercapacitorbetween
SENSE+ and SENSE– should be as close as possible
to the IC. Ensure accurate current sensing with Kelvin
connections at the SENSE resistor.
5. Is the INTVCC decoupling capacitor connected close to
the IC, between the INTVCC and the power ground pins?
ThiscapacitorcarriestheMOSFETdriverscurrentpeaks.
Anadditional1Fceramiccapacitorplacedimmediately
next to the INTVCC and PGND pins can help improve
noise performance substantially.
6. Keep the switching node (SW), top gate node (TG), and
boost node (BOOST) away from sensitive small-signal
nodes.Allofthesenodeshaveverylargeandfastmoving
signals and therefore should be kept on the “output side”
of the LTC3835 and occupy minimum PC trace area.
7. Use a modified “star ground” technique: a low imped-
ance, large copper area central grounding point on
the same side of the PC board as the input and output
capacitors with tie-ins for the bottom of the INTVCC
decouplingcapacitor,thebottomofthevoltagefeedback
resistive divider and the SGND pin of the IC.
PC Board Layout Debugging
It is helpful to use a DC-50MHz current probe to monitor
thecurrentintheinductorwhiletestingthecircuit.Monitor
the output switching node (SW pin) to synchronize the
oscilloscope to the internal oscillator and probe the actual
output voltage as well. Check for proper performance
over the operating voltage and current range expected
in the application. The frequency of operation should be
maintained over the input voltage range down to dropout
and until the output load drops below the low current
operation threshold—typically 10% of the maximum
designed current level in Burst Mode operation.
Thedutycyclepercentageshouldbemaintainedfromcycle
tocycleinawell-designed,lownoisePCBimplementation.
Variation in the duty cycle at a subharmonic rate can sug-
gest noise pickup at the current or voltage sensing inputs
or inadequate loop compensation. Overcompensation of
the loop can be used to tame a poor PC layout if regulator
bandwidth optimization is not required.
Reduce VIN from its nominal level to verify operation
of the regulator in dropout. Check the operation of the
undervoltage lockout circuit by further lowering VIN while
monitoring the outputs to verify operation.
Investigate whether any problems exist only at higher out-
put currents or only at higher input voltages. If problems
coincide with high input voltages and low output currents,
look for capacitive coupling between the BOOST, SW, TG,
and possibly BG connections and the sensitive voltage
and current pins. The capacitor placed across the current
sensing pins needs to be placed immediately adjacent to
the pins of the IC. This capacitor helps to minimize the
effects of differential noise injection due to high frequency
capacitive coupling. If problems are encountered with
high current output loading at lower input voltages, look
for inductive coupling between CIN, Schottky and the top
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