參數(shù)資料
型號(hào): LPC1313FHN33/01,55
廠商: NXP Semiconductors
文件頁數(shù): 62/74頁
文件大?。?/td> 0K
描述: MCU CORTEX M3 32KB FLASH 32HVQFN
標(biāo)準(zhǔn)包裝: 260
系列: LPC13xx
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 72MHz
連通性: I²C,Microwire,SPI,SSI,UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,WDT
輸入/輸出數(shù): 28
程序存儲(chǔ)器容量: 32KB(32K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 8K x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 32-VQFN 裸露焊盤
包裝: 托盤
其它名稱: 568-8375
LPC1311_13_42_43
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 6 June 2012
65 of 74
NXP Semiconductors
LPC1311/13/42/43
32-bit ARM Cortex-M3 microcontroller
12. Package outline
Fig 38. Package outline SOT313-2 (LQFP48)
UNIT
A
max.
A1
A2
A3
bp
cE(1)
eHE
LLp
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.95
0.55
7
0
o
0.12
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2
MS-026
136E05
00-01-19
03-02-25
D(1)
(1)
7.1
6.9
HD
9.15
8.85
E
Z
0.95
0.55
D
bp
e
E
B
12
D
H
b p
E
H
v M B
D
ZD
A
Z E
e
v M A
1
48
37
36
25
24
13
θ
A1
A
L p
detail X
L
(A )
3
A2
X
y
c
w M
0
2.5
5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
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