參數(shù)資料
型號(hào): LPC11U24FHI33/301,
廠商: NXP Semiconductors
文件頁數(shù): 63/74頁
文件大小: 0K
描述: MCU USB 33HVQFN
產(chǎn)品培訓(xùn)模塊: Code Density for LPC11xx
標(biāo)準(zhǔn)包裝: 490
系列: LPC11Uxx
核心處理器: ARM? Cortex?-M0
芯體尺寸: 32-位
速度: 50MHz
連通性: I²C,Microwire,SPI,SSI,SSP,UART/USART,USB
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,WDT
輸入/輸出數(shù): 26
程序存儲(chǔ)器容量: 32KB(32K x 8)
程序存儲(chǔ)器類型: 閃存
EEPROM 大?。?/td> 2K x 8
RAM 容量: 8K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 32-VFQFN 裸露焊盤
包裝: 托盤
其它名稱: 568-8523
LPC11U24FHI33/301,-ND
LPC11U2X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.2 — 11 March 2014
66 of 74
NXP Semiconductors
LPC11U2x
32-bit ARM Cortex-M0 microcontroller
Fig 41. Reflow soldering for the LQFP48 package
SOT313-2
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP48 package
Ax
Bx
Gx
Gy
Hy
Hx
Ay
By
P1
D2 (8
×)
D1
(0.125)
Ax
Ay
Bx
By
D1
D2
Gx
Gy
Hx
Hy
10.350
P2
0.560
10.350
7.350
P1
0.500
0.280
C
1.500
0.500
7.500
10.650 10.650
sot313-2_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
P2
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