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參數資料
| 型號： | LP3906SQX-TKXII |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHING REGULATOR, 2000 kHz SWITCHING FREQ-MAX, QCC24 |
| 封裝： | 5 X 4 MM, 0.80 MM HEIGHT, LLP-24 |
| 文件頁數： | 31/40頁 |
| 文件大?。?/td> | 4200K |
| 代理商： | LP3906SQX-TKXII |
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Thermal Performance of the LLP
Package
The LP3906 is a monolithic device with integrated power
FETs. For that reason, it is important to pay special attention
to the thermal impedance of the LLP package and to the PCB
layout rules in order to maximize power dissipation of the LLP
package.
The LLP package is designed for enhanced thermal perfor-
mance and features an exposed die attach pad at the bottom
center of the package that creates a direct path to the PCB
for maximum power dissipation. Compared to the traditional
leaded packages where the die attach pad is embedded in-
side the molding compound, the LLP reduces one layer in the
thermal path.
The thermal advantage of the LLP package is fully realized
only when the exposed die attach pad is soldered down to a
thermal land on the PCB board with thermal vias planted un-
derneath the thermal land. Based on thermal analysis of the
LLP package, the junction-to-ambient thermal resistance
(
θJA) can be improved by a factor of two when the die attach
pad of the LLP package is soldered directly onto the PCB with
thermal land and thermal vias, as opposed to an alternative
with no direct soldering to a thermal land. Typical pitch and
outer diameter for thermal vias are 1.27mm and 0.33mm re-
spectively. Typical copper via barrel plating is 1oz, although
thicker copper may be used to further improve thermal per-
formance. The LP3906 die attach pad is connected to the
substrate of the IC and therefore, the thermal land and vias
on the PCB board need to be connected to ground (GND pin).
For more information on board layout techniques, refer to Ap-
plication Note AN–1187 “Leadless Lead frame Package
(LLP).” on http://www.national.com This application note also
discusses package handling, solder stencil and the assembly
process.
37
www.national.com
LP3906
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相關代理商/技術參數 |
參數描述 |
|---|---|
| LP3906SQX-TKXII/NOPB | 功能描述:低壓差穩(wěn)壓器 - LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調節(jié):0.3 % 輸出端數量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LP3906SQX-VPFP/NOPB | 功能描述:其他電源管理 RoHS:否 制造商:Texas Instruments 輸出電壓范圍: 輸出電流:4 mA 輸入電壓范圍:3 V to 3.6 V 輸入電流: 功率耗散: 工作溫度范圍:- 40 C to + 110 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-48 封裝:Reel |
| LP3907 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Dual High-Current Step-Down DC/DC and Dual Linear Regulator with I2C Compatible Interface |
| LP3907QSQ-JJXP/NOPB | 功能描述:上下轉換器 Dual Hi-Current SD DC/DC RoHS:否 制造商:Texas Instruments 產品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PQFP-128 |
| LP3907QSQ-JXI7/NOPB | 功能描述:低壓差穩(wěn)壓器 - LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調節(jié):0.3 % 輸出端數量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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