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參數(shù)資料
| 型號： | KXPC8260ZUIHBC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 2/41頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC II 480-TBGA |
| 標準包裝： | 2 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 200MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 480-LBGA |
| 供應商設備封裝： | 408-TBGA（37.5x37.5） |
| 包裝： | 托盤 |
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MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
10
Freescale Semiconductor
Electrical and Thermal Characteristics
2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and
TJ is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving equations (1) and (2) iteratively for any value of TA.
3 Rev C.2 silicon only.
Table 4. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
Thermal resistance for TBGA
θJA
13.071
1 Assumes a single layer board with no thermal vias
°C/W
NC2
2 Natural convection
θJA
9.551
°C/W
1 m/s
θJA
10.483
3 Assumes a four layer board
°C/W
NC
θJA
7.783
°C/W
1 m/s
Note:
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