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參數(shù)資料
| 型號： | ISL95711 |
| 廠商： | Intersil Corporation |
| 英文描述： | Terminal Voltage 3V or 5V, 128 Taps I2C Serial Interface |
| 中文描述： | 終端電壓3V或5V，128絲錐I2C串行接口 |
| 文件頁數(shù)： | 12/12頁 |
| 文件大?。?/td> | 333K |
| 代理商： | ISL95711 |
12
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8241.2
August 15, 2005
MSOP Packaging Information
10 Lead MSOP, Package Code
1
2
3
4
5
0.0197 [0.50] BSC
0.1970 [5.00]
0.1890 [4.80]
(S)
10
9
8
7
6
0.0374 [0.95]
0.0295 [0.75]
4
0.0059 [0.15]
0.0020 [0.05]
(S)
0.0433 [1.10] MAX.
0.0039 [0.10]
MAX.
(S)
0.0106 [0.27]
0.0067 [0.17]
2
0.1220 [3.10]
0.1142 [2.90]
0.0098 [0.25]
GAUGE PLANE
A
A
0°-6°
3
0.1220 [3.10]
0.1142 [2.90]
SECTION A-A
0.1220 [3.10]
0.1142 [2.90]
BASE
METAL
4
0.0106 [0.27]
0.0067 [0.17]
WITH
PLATING
0.0050 [0.127]
0.0091 [0.23]
0.0051 [0.13]
WITH PLATING
0.0080 [0.203]
REF
NOTES:
1. Package dimensions conform to JEDEC specification MO-187BA.
2.
Does not include mold flash, protrusion
or gate burrs, mold flash protrusions
or gate burrs shall not exceed 0.15 mm per side.
3.
Does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side.
4.
Does not include dambar protrusion. Allowable dambar protrusion shall be 0.8 mm.
5. Lead span/stand-off height/coplanarity are considered as special characteristics.
6. Controlling dimensions in inches [mm].
2
3
4
3
0.0276 [0.70]
0.0157 [0.40]
ISL95711
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| ISL95711UIU10Z | 功能描述:IC POT DGTL 50K OHM 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:3,300 系列:WiperLock™ 接片:257 電阻（歐姆）:100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 150 ppm/°C 存儲器類型:易失 接口:3 線 SPI（芯片選擇） 電源電壓:1.8 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-VDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN-EP（3x3） 包裝:帶卷 (TR) |
| ISL95711UIU10Z-T | 功能描述:IC POT DGTL 50K OHM 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻（歐姆）:10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲器類型:非易失 接口:3 線串行（芯片選擇，遞增，增/減） 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-TDFN（2x3） 包裝:帶卷 (TR) |
| ISL95711WIU10Z | 功能描述:IC XDCP 128-TAP 10KOHM 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻（歐姆）:10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲器類型:非易失 接口:3 線串行（芯片選擇，遞增，增/減） 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-TDFN（2x3） 包裝:帶卷 (TR) |
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| ISL95810UI8Z | 制造商:Intersil Corporation 功能描述: |
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