參數(shù)資料
型號(hào)： ISL6609CRZ-T
廠商： INTERSIL CORP
元件分類： MOSFETs
英文描述： Synchronous Rectified MOSFET Driver
中文描述： 4 A AND GATE BASED MOSFET DRIVER, PQCC8
封裝： 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220VEEC, QFN-8
文件頁(yè)數(shù)： 10/11頁(yè)
文件大小： 321K
代理商： ISL6609CRZ-T
10
FN9221.0
August 10, 2005
ISL6609, ISL6609A
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L8.3x3
8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VEEC ISSUE C)
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.80
0.90
1.00
-
A1
-
-
0.05
-
A2
-
-
1.00
9
A3
0.20 REF
9
b
0.23
0.28
0.38
5, 8
D
3.00 BSC
-
D1
2.75 BSC
9
D2
0.25
1.10
1.25
7, 8
E
3.00 BSC
-
E1
2.75 BSC
9
E2
0.25
1.10
1.25
7, 8
e
0.65 BSC
-
k
0.25
-
-
L
0.35
0.60
0.75
8
L1
-
-
0.15
10
N
8
2
Nd
2
3
Ne
2
3
P
-
-
0.60
9
θ
-
-
12
9
Rev. 1 10/02
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ
are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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ISL6609IBZ-T 功能描述:IC MOSFET DRVR SYNC BUCK 8-SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動(dòng)器 - 外部開(kāi)關(guān) 系列:- 標(biāo)準(zhǔn)包裝:5 系列:- 配置:低端 輸入類型:非反相 延遲時(shí)間:600ns 電流 - 峰:12A 配置數(shù):1 輸出數(shù):1 高端電壓 - 最大（自引導(dǎo)啟動(dòng)）:- 電源電壓:14.2 V ~ 15.8 V 工作溫度:-20°C ~ 60°C 安裝類型:通孔 封裝/外殼:21-SIP 模塊 供應(yīng)商設(shè)備封裝:模塊 包裝:散裝 配用:BG2A-NF-ND - KIT DEV BOARD FOR IGBT 其它名稱:835-1063
ISL6609IR 制造商:Intersil Corporation 功能描述:MOSFET DRVR 4A 2-OUT HI/LO SIDE INV/NON-INV 8QFN EP - Rail/Tube
ISL6609IR-T 制造商:Intersil Corporation 功能描述:MOSFET DRVR 4A 2-OUT HI/LO SIDE INV/NON-INV 8QFN EP - Bulk
ISL6609IRZ 功能描述:IC MOSFET DRVR SYNC BUCK 8-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動(dòng)器 - 外部開(kāi)關(guān) 系列:- 標(biāo)準(zhǔn)包裝:5 系列:- 配置:低端 輸入類型:非反相 延遲時(shí)間:600ns 電流 - 峰:12A 配置數(shù):1 輸出數(shù):1 高端電壓 - 最大（自引導(dǎo)啟動(dòng)）:- 電源電壓:14.2 V ~ 15.8 V 工作溫度:-20°C ~ 60°C 安裝類型:通孔 封裝/外殼:21-SIP 模塊 供應(yīng)商設(shè)備封裝:模塊 包裝:散裝 配用:BG2A-NF-ND - KIT DEV BOARD FOR IGBT 其它名稱:835-1063
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