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參數(shù)資料
| 型號： | ISL54102CQZ |
| 廠商： | Intersil |
| 文件頁數(shù)： | 14/21頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TMDS REGEN W/MUX 128MQFP |
| 標(biāo)準(zhǔn)包裝： | 66 |
| 應(yīng)用： | 顯示器 |
| 接口： | I²C |
| 電源電壓： | 3 V ~ 3.6 V |
| 封裝/外殼： | 128-BFQFP |
| 供應(yīng)商設(shè)備封裝： | 128-MQFP（14x20） |
| 包裝： | 托盤 |
| 安裝類型： | 表面貼裝 |
| 產(chǎn)品目錄頁面： | 1244 (CN2011-ZH PDF) |
21
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6275.5
June 4, 2008
ISL54100, ISL54101, ISL54102
Metric Plastic Quad Flatpack Packages (MQFP)
Y
ALL AROUND
DROP IN HEAT SPREADER
4 STAND POINTS MAY BE EXPOSED
PIN 1 ID
D1
D
E
E1
18.
500
REF
12.500 REF
C0.600x0.350
(4X)
19.
870
±0.
100
20.
000
±0.
10
0
(E
1)
13.870 ±0.100
14.000 ±0.100
A
12° ALL
AROUND
(D1)
1
1 SECTION A-A
T
b
b1
T1
ccc
C
A2
A
A1
R0.13 MIN
R0.25 TYP
C
ddd
C
M
L1
0° MIN
0.200 MIN
α
T
GAUGE
PLANE
DETAIL Y
0.13~0.30
128
1
L
b
e
SEATING
PLANE
0.25 BASE
DO NOT TRY TO CONNECT ELECTRICALLY
MDP0055
14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT
SPREADER) 3.2mm FOOTPRINT
SYMBOL
DIMENSIONS
(MILLIMETERS)
REMARKS
A
Max 3.40
Overall height
A1
0.250~0.500
Standoff
A2
2.750 ±0.250
Package thickness
α
0°~7°
Foot angle
b
0.220 ±0.050
Lead width
b1
0.200 ±0.030
Lead base metal width
D
17.200 ±0.250
Lead tip to tip
D1
14.000 ±0.100
Package length
E
23.200 ±0.250
Lead tip to tip
E1
20.000 ±0.100
Package width
e
0.500 Base
Lead pitch
L
0.880 ±0.150
Foot length
L1
1.600 Ref.
Lead length
T
0.170 ±0.060
Frame thickness
T1
0.152 ±0.040
Frame base metal thickness
ccc
0.100
Foot coplanarity
ddd
0.100
Foot position
Rev. 2 2/07
NOTES:
1. General tolerance: Distance ±0.100, Angle +2.5°.
2.
Matte finish on package body surface except ejection and
pin 1 marking (Ra 0.8~2.0um).
3. All molded body sharp corner RADII unless otherwise specified
(Max RO.200).
4. Package/Leadframe misalignment (X, Y): Max. 0.127
5. Top/Bottom misalignment (X, Y): Max. 0.127
6. Drawing does not include plastic or metal protrusion or cutting
burr.
7.
Compliant to JEDEC MS-022.
1
2
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