13 FN6870.1 September 23, 2010 Package Outline Drawing Q48.7x7B 48 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE Rev 2, 7/10 BOT" />
參數(shù)資料
型號(hào): ISL34321INZ-T13
廠商: Intersil
文件頁數(shù): 5/13頁
文件大小: 0K
描述: IC SER/DESER LVDS SERDES 48TQFP
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 1,000
功能: 串行器/解串器
輸入類型: LVTTL/LVCMOS
輸出類型: LVTTL,LVCMOS
輸入數(shù): 2
輸出數(shù): 2
電源電壓: 1.7 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 48-TQFP 裸露焊盤
供應(yīng)商設(shè)備封裝: 48-TQFP 裸露焊盤(7x7)
包裝: 帶卷 (TR)
ISL34321
13
FN6870.1
September 23, 2010
Package Outline Drawing
Q48.7x7B
48 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE
Rev 2, 7/10
BOTTOM VIEW
DETAIL "A"
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
0.20 MIN.
(1.00)
0.09/0.20
0.17/0.23
BASE METAL
0.09/0.16
7
0.17/0.27
11/13°
WITH LEAD FINISH
0.08
C
MA-B D
0.05/0.15
SEE DETAIL "A"
C
0.08
1.20 MAX
1.00 ±0.05
H
GAUGE
0.60 ±0.15
0-7°
0.25
0° MIN.
0.50
3
A
5
4
D 3
9.0±0.20
4
5
EXPOSED PAD
4.00±0.1
2
(10.00)
(4.00)
(0.28) TYP
(4.00)
(1.50) TYP
4.00±0.1
(10.00)
3
B
9.0±0.20
7.0±0.10
PLANE
NOTES:
MS-026, variation ABC-HD.
8. Controlling dimension: millimeter.
This outline conforms to JEDEC publication 95 registration
condition. Dambar cannot be located on the lower radius or
dambar protrusion shall be 0.08mm total at maximum material
Dimension does not include dambar protrusion. Allowable
6. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
3. Datums A-B and D to be determined at centerline between
leads where leads exit plastic body at datum plane H.
4. Dimensions do not include mold protrusion. Allowable mold
protrusion is 0.254mm on D1 and E1 dimensions.
9.
7.
5. These dimensions to be determined at datum plane H.
10. Dimensions in ( ) are for reference only.
the foot.
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