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參數(shù)資料
| 型號： | ISD17210XYI01 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| 中文描述： | 多信息單芯片語音記錄 |
| 文件頁數(shù)： | 13/24頁 |
| 文件大?。?/td> | 365K |
| 代理商： | ISD17210XYI01 |
ISD1700 SERIES
Publication Release Date: January 23, 2007
- 13 -
Revision 1.3-S2
8 ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS (DIE)
[1]
CONDITIONS
VALUES
Junction temperature
Storage temperature range
Voltage Applied to any pads
Power supply voltage to ground potential
150
0
C
-65
0
C to +150
0
C
(V
SS
- 0.3V) to (V
CC
+ 0.3V)
-0.3V to +7.0V
ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)
[1]
CONDITIONS
VALUES
Junction temperature
Storage temperature range
Voltage Applied to any pins
Voltage applied to any pin (Input current limited to +/-20 mA)
Power supply voltage to ground potential
150
0
C
-65
0
C to +150
0
C
(V
SS
- 0.3V) to (V
CC
+ 0.3V)
(V
SS
– 1.0V) to (V
CC
+ 1.0V)
-0.3V to +7.0V
[1]
Stresses above those listed may cause permanent damage to the device. Exposure to the absolute
maximum ratings may affect device reliability. Functional operation is not implied at these conditions.
8.1
O
PERATING
C
ONDITIONS
OPERATING CONDITIONS (DIE)
CONDITIONS
VALUES
Operating temperature range
Supply voltage (V
CC
)
[1]
Ground voltage (V
SS
)
[2]
Input voltage (V
CC
)
[1]
Voltage applied to any pins
0°C to +50°C
+2.4 V to +5.5 V
0 V
0 V to 5.5 V
(V
SS
–0.3 V) to (V
CC
+0.3 V)
OPERATING CONDITIONS (PACKAGED PARTS)
CONDITIONS
VALUES
Operating temperature range (Case temperature)
Supply voltage (V
DD
)
[1]
Ground voltage (V
SS
)
[2]
Input voltage (V
DD
)
[1]
Voltage applied to any pins
-40°C to +85°C
+2.4V to +5.5V
0V
0V to 5.5V
(V
SS
–0.3V) to (V
DD
+0.3V)
[1]
V
CC
= V
CCA
= V
CCD
= V
CCP
[2]
V
SS
= V
SSA
= V
SSD
= V
SSP1
V
SSP2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISD17210XYIR | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD1750A | Multi-Message Single-Chip Voice Record&Playback Devices |
| ISD1700A | Multi-Message Single-Chip Voice Record&Playback Devices |
| ISD1740A | RES 2K00 SM 1/8W F 0805C THKF 100PPM TR |
| ISD1760A | Multi-Message Single-Chip Voice Record&Playback Devices |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISD17210XYIR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYIR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17240 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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