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參數(shù)資料
| 型號(hào)： | ISD17210XYI01 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| 中文描述： | 多信息單芯片語音記錄 |
| 文件頁數(shù)： | 12/24頁 |
| 文件大小： | 365K |
| 代理商： | ISD17210XYI01 |
ISD1700 SERIES
- 12 -
7.2 SPI
O
PERATION
T
SSH
T
SSmin
T
SCKhi
T
SSS
T
DIS
T
DIH
T
SCKlow
T
DF
(TRISTATE)
SS
SCLK
MOSI
MISO
LSB
T
PD
MSB
LSB
MSB
Figure 12.8: SPI Operation
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
SS
Setup Time
T
SSS
500
nsec
SS
Hold Time
T
SSH
500
nsec
Data in Setup Time
T
DIS
200
nsec
Data in Hold Time
T
DIH
200
nsec
Output Delay
T
PD
500
nsec
Output Delay to HighZ
T
DF
500
nsec
SS
HIGH
T
SSmin
1
μsec
SCLK High Time
T
SCKhi
400
nsec
SCLK Low Time
T
SCKlow
400
nsec
CLK Frequency
F
0
1,000
KHz
Power-Up Delay
[1]
Notes:
[1]
The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for
slower sampling frequency.
T
PUD
50
msec
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISD17210XYIR | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD1750A | Multi-Message Single-Chip Voice Record&Playback Devices |
| ISD1700A | Multi-Message Single-Chip Voice Record&Playback Devices |
| ISD1740A | RES 2K00 SM 1/8W F 0805C THKF 100PPM TR |
| ISD1760A | Multi-Message Single-Chip Voice Record&Playback Devices |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISD17210XYIR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYIR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17240 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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