參數(shù)資料
型號： ISD17210XY01
廠商： WINBOND ELECTRONICS CORP
英文描述： R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
中文描述： 多信息單芯片語音記錄
文件頁數(shù)： 2/24頁
文件大?。?/td> 365K
代理商： ISD17210XY01
ISD1700 SERIES
- 2 -
TABLE OF CONTENTS
1
2
3
4
5
6
GENERAL DESCRIPTION..............................................................................................................3
FEATURES......................................................................................................................................4
BLOCK DIAGRAM...........................................................................................................................5
PINOUT CONFIGURATION............................................................................................................6
PIN DESCRIPTION.........................................................................................................................7
MODES OF OPERATIONS.............................................................................................................8
6.1
Standalone (Push-Button) Mode .............................................................................................8
6.2
SPI Mode .................................................................................................................................8
7
TIMING DIAGRAMS........................................................................................................................8
7.1
Standalone Operation..............................................................................................................8
7.2
SPI Operation.........................................................................................................................12
8
ABSOLUTE MAXIMUM RATINGS................................................................................................13
8.1
Operating Conditions.............................................................................................................13
9
ELECTRICAL CHARACTERISTICS .............................................................................................14
9.1
DC Parameters ......................................................................................................................14
9.2
AC Parameters.......................................................................................................................15
10
TYPICAL APPLICATION CIRCUITS.............................................................................................16
10.1
Good Audio Design Practices................................................................................................18
11
PACKAGING .................................................................................................................................19
11.1
28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19
11.2
28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20
11.3
28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................21
11.4
Die Information.......................................................................................................................21
12
ORDERING INFORMATION.........................................................................................................22
13
VERSION HISTORY......................................................................................................................23
相關(guān)PDF資料
PDF描述
ISD17210XYI R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XYI01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XYIR R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD1750A Multi-Message Single-Chip Voice Record&Playback Devices
ISD1700A Multi-Message Single-Chip Voice Record&Playback Devices
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210XYI 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYI01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYIR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
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