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參數(shù)資料
| 型號： | ISD17210XY01 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| 中文描述： | 多信息單芯片語音記錄 |
| 文件頁數(shù)： | 11/24頁 |
| 文件大小： | 365K |
| 代理商： | ISD17210XY01 |
ISD1700 SERIES
Publication Release Date: January 23, 2007
- 11 -
Revision 1.3-S2
RESET
RDY
T
Reset
T
r
T
f
LED
Device returns to Power Down state
T
Set2
Figure 12.6: Reset Operation
RDY
AUD
PLAY
T
Deb
T
Sc1
T
RD
T
r
T
Sc2
T
RU
T
LH
T
f
LED
T
Cyc
> T
Deb
T
RU
T
RD
Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISD17210XYI | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD17210XYI01 | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD17210XYIR | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD1750A | Multi-Message Single-Chip Voice Record&Playback Devices |
| ISD1700A | Multi-Message Single-Chip Voice Record&Playback Devices |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISD17210XYI | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYI01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYIR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYIR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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