參數資料
型號: IS61LPD25636A-200B3I
廠商: INTEGRATED SILICON SOLUTION INC
元件分類: SRAM
英文描述: 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
中文描述: 256K X 36 CACHE SRAM, 3.1 ns, PBGA165
封裝: 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165
文件頁數: 16/32頁
文件大小: 311K
代理商: IS61LPD25636A-200B3I
Integrated Silicon Solution, Inc. — 1-800-379-4774
23
Rev. B
12/13/06
IS61VPD25636A, IS61VPD51218A, IS61LPD25636A, IS61LPD51218A
ISSI
TAP Electrical Characteristics Over the Operating Range(1,2)
Symbol
Parameter
Test Conditions
Min.
Max.
Units
VOH1
Output HIGH Voltage
IOH = –2.0 mA
1.7
V
VOH2
Output HIGH Voltage
IOH = –100 A
2.1
V
VOL1
Output LOW Voltage
IOL = 2.0 mA
0.7
V
VOL2
Output LOW Voltage
IOL = 100 A
0.2
V
VIH
Input HIGH Voltage
1.7
VDD +0.3
V
VIL
Input LOW Voltage
–0.3
0.7
V
IX
Input Load Current
Vss
≤ V I ≤ VDDQ
–5
5
mA
Notes:
1. All Voltage referenced to Ground.
2. Overshoot: VIH (AC)
≤ VDD +1.5V for t
tTCYC/2,
Undershoot:VIL (AC)
0.5V for t tTCYC/2,
Power-up: VIH < 2.6V and VDD < 2.4V and VDDQ < 1.4V for t < 200 ms.
TAP AC ELECTRICAL CHARACTERISTICS(1,2) (OVER OPERATING RANGE)
Symbol Parameter
Min.
Max.
Unit
tTCYC
TCK Clock cycle time
100
ns
fTF
TCK Clock frequency
10
MHz
tTH
TCK Clock HIGH
40
ns
tTL
TCK Clock LOW
40
ns
tTMSS
TMS setup to TCK Clock Rise
10
ns
tTDIS
TDI setup to TCK Clock Rise
10
ns
tCS
Capture setup to TCK Rise
10
ns
tTMSH
TMS hold after TCK Clock Rise
10
ns
tTDIH
TDI Hold after Clock Rise
10
ns
tCH
Capture hold after Clock Rise
10
ns
tTDOV
TCK LOW to TDO valid
20
ns
tTDOX
TCK LOW to TDO invalid
0
ns
Notes:
1. Both tCS and tCH refer to the set-up and hold time latching data requirements from the boundary scan register.
2. Test conditions are specified using the load in TAP AC test conditions. tR/tF = 1 ns.
相關PDF資料
PDF描述
IS61LPD25636A-200TQ 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQ2I 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQI 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-250B2 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
相關代理商/技術參數
參數描述
IS61LPD25636A-200TQ 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQ2I 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQI 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQLI 功能描述:靜態(tài)隨機存取存儲器 8M (256Kx36) 200MHz Sync 靜態(tài)隨機存取存儲器 3.3v RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
IS61LPD25636A-200TQLI-TR 功能描述:靜態(tài)隨機存取存儲器 8M (256Kx36) 200MHz Sync 靜態(tài)隨機存取存儲器 3.3v RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray