參數(shù)資料
型號(hào): IRLU3103
廠商: International Rectifier
英文描述: Power MOSFET(Vdss=30V, Rds(on)=0.019ohm, Id=46A)
中文描述: 功率MOSFET(減振鋼板基本\u003d 30V的,的Rds(on)\u003d 0.019ohm,身份證\u003d 46A條)
文件頁(yè)數(shù): 1/10頁(yè)
文件大?。?/td> 164K
代理商: IRLU3103
HEXFET
Power MOSFET
IRLR/U3103
PD - 9.1333B
l
Logic-Level Gate Drive
l
Ultra Low On-Resistance
l
Surface Mount (IRLR3103)
l
Straight Lead (IRLU3103)
l
Advanced Process Technology
l
Fast Switching
l
Fully Avalanche Rated
8/7/96
V
DSS
= 30V
R
DS(on)
= 0.019
I
D
= 46A
S
D
G
D-PA K
TO-252A A
I-PAK
TO-251AA
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
device for use in a wide variety of applications.
The D-PAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU series) is for through-hole mounting
applications. Power dissipation levels up to 1.5 watts are
possible in typical surface mount applications.
Absolute Maximum Ratings
Description
PRELIMINARY
Parameter
Max.
46
29
220
69
0.56
±16
240
34
6.9
2.0
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
A
W
W/°C
V
mJ
A
mJ
V/ns
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
-55 to + 150
°C
300 (1.6mm from case)
Parameter
Min.
––––
––––
––––
Typ.
––––
––––
––––
Max.
1.8
50
110
Units
R
θ
JC
R
θ
JA
R
θ
JA
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
Junction-to-Case
Junction-to-Ambient (PCB mount)**
Junction-to-Ambient
°C/W
Thermal Resistance
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