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參數(shù)資料
| 型號： | IRLR3410PBF |
| 廠商： | International Rectifier |
| 英文描述： | Asynchronous SRAM; Organization (word): 1M; Organization (bit): x 4; Memory capacity (bit): 4M; Access time (ns): 12; Supply voltage (V): 4.5 to 5.5; Operating temperature (°C): 0 to 70; Package: SOJ (32); Status:   Remarks:   |
| 中文描述： | ㈢的HEXFET功率MOSFET |
| 文件頁數(shù)： | 2/11頁 |
| 文件大?。?/td> | 294K |
| 代理商： | IRLR3410PBF |
IRLR/U3410PbF
2
www.irf.com
Parameter
Min. Typ. Max. Units
100
–––
–––
0.122 –––
–––
––– 0.105
–––
––– 0.125
–––
––– 0.155
1.0
–––
7.7
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
7.2
–––
53
–––
30
–––
26
Conditions
V
GS
= 0V, I
D
= 250μA
Reference to 25°C, I
D
= 1mA
V
GS
= 10V, I
D
= 10A
V
GS
= 5.0V, I
D
= 10A
V
GS
= 4.0V, I
D
= 9.0A
V
DS
= V
GS
, I
D
= 250μA
V
DS
= 25V, I
D
= 9.0A
V
DS
= 100V, V
GS
= 0V
V
DS
= 80V, V
GS
= 0V, T
J
= 150°C
V
GS
= 16V
V
GS
= -16V
I
D
= 9.0A
V
DS
= 80V
V
GS
= 5.0V, See Fig. 6 and 13
V
DD
= 50V
I
D
= 9.0A
R
G
,
V
GS
= 5.0V
R
D
= 5.5
,
See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
V
GS
= 0V
V
DS
= 25V
= 1.0MHz, See Fig. 5
V
(BR)DSS
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
Drain-to-Source Breakdown Voltage
–––
V
V/°C
W
V
GS(th)
g
fs
Gate Threshold Voltage
Forward Transconductance
2.0
–––
25
250
100
-100
34
4.8
20
–––
–––
–––
–––
V
S
μA
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
nA
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
nC
ns
C
iss
C
oss
C
rss
Source-Drain Ratings and Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
800
160
90
–––
–––
–––
pF
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
nH
I
GSS
S
D
G
L
S
Internal Source Inductance
–––
7.5
–––
R
DS(on)
Static Drain-to-Source On-Resistance
L
D
Internal Drain Inductance
4.5
I
DSS
Drain-to-Source Leakage Current
S
D
G
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
J
= 25°C, I
S
= 9.0A, V
GS
= 0V
T
J
= 25°C, I
F
=9.0A
di/dt = 100A/μs
–––
–––
I
SM
–––
–––
V
SD
t
rr
Q
rr
t
on
–––
–––
–––
–––
140
740 1100
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
1.3
210
V
ns
nC
A
17
60
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
V
DD
= 25V, starting T
J
= 25°C, L = 3.1mH
R
G
= 25
, I
AS
= 9.0A. (See Figure 12)
I
SD
≤
9.0A, di/dt
≤
540A/μs, V
DD
≤
V
(BR)DSS
,
T
J
≤
175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
This is applied for I-PAK, L
S
of D-PAK is measured between lead and
center of die contact
Uses IRL530N data and test conditions
Pulse width
≤
300μs; duty cycle
≤
2%
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