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3-156
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+8.0V
Input, Output or I/O Voltage . . . . . . . . . . . .GND -0.5V to V
CC
+0.5V
Storage Temperature Range . . . . . . . . . . . . . . . . . -65
o
C to +150
o
C
Junction Temperature
Ceramic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175
o
C
Plastic Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150
o
C
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . +300
o
C
(Lead tips only for surface mount packages)
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Information
Thermal Resistance (Typical, Note 1)
PDIP Package . . . . . . . . . . . . . . . . . . .
PLCC Package . . . . . . . . . . . . . . . . . .
SBDIP Package. . . . . . . . . . . . . . . . . .
CLCC Package . . . . . . . . . . . . . . . . . .
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9750 Gates
θ
JA
(
o
C/W)
50
46
30
40
θ
JC
(
o
C/W)
N/A
N/A
6
6
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Operating Conditions
Operating Supply Voltage. . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
M80C86-2 ONLY. . . . . . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V
Operating Temperature Range: C80C86/-2 . . . . . . . . 0
o
C to +70
o
C
I80C86/-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40
o
C to +85
o
C
M80C86/-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55
o
C to +125
o
C
DC Electrical Specifications
V
CC
= 5.0V,
±
10%; T
A
= 0
o
C to +70
o
C (C80C86, C80C86-2)
V
CC
= 5.0V,
±
10%; T
A
= -40
o
C to +85
o
C (l80C86, I80C86-2)
V
CC
= 5.0V,
±
10%; T
A
= -55
o
C to +125
o
C (M80C86)
V
CC
= 5.0V,
±
5%;
T
A
= -55
o
C to +125
o
C (M80C86-2)
SYMBOL
PARAMETER
MIN
MAX
UNITS
TEST CONDITION
V
lH
Logical One
Input Voltage
2.0
2.2
V
V
C80C86, I80C86 (Note 5)
M80C86 (Note 5)
V
IL
V
IHC
V
ILC
V
OH
Logical Zero Input Voltage
0.8
V
CLK Logical One Input Voltage
V
CC
-0.8
V
CLK
Logical Zero Input Voltage
0.8
V
Output High Voltage
3.0
V
CC
-0.4
V
V
l
OH
= -2.5mA
l
OH
= -100
μ
A
l
OL
= +2.5mA
V
IN
= GND or V
CC
DIP
Pins 17-19, 21-23, 33
V
OL
I
I
Output Low Voltage
0.4
V
Input Leakage Current
-1.0
1.0
μ
A
l
BHH
l
BHL
I
O
I
CCSB
I
CCOP
Input Current-Bus Hold High
-40
-400
μ
A
V
IN
= - 3.0V (Note 1)
V
IN
= - 0.8V (Note 2)
V
OUT
= GND (Note 4)
V
CC
= - 5.5V (Note 3)
FREQ = Max, V
IN
= V
CC
or GND,
Outputs Open
Input Current-Bus Hold Low
40
400
μ
A
Output Leakage Current
-
-10.0
μ
A
Standby Power Supply Current
-
500
μ
A
Operating Power Supply Current
-
10
mA/MHz
Capacitance
T
A
= 25
o
C
SYMBOL
PARAMETER
TYPICAL
UNITS
TEST CONDITIONS
C
IN
C
OUT
C
I/O
Input Capacitance
25
pF
FREQ = 1MHz. All measurements are referenced to device GND
Output Capacitance
25
pF
FREQ = 1MHz. All measurements are referenced to device GND
I/O Capacitance
25
pF
FREQ = 1MHz. All measurements are referenced to device GND
NOTES:
2. lBHH should be measured after raising V
IN
to V
CC
and then lowering to 3.0V on the following pins 2-16, 26-32, 34-39.
3. IBHL should be measured after lowering V
IN
to GND and then raising to 0.8V on the following pins: 2-16, 34-39.
4. lCCSB tested during clock high time after halt instruction executed. V
IN
= V
CC
or GND, V
CC
= 5.5V, Outputs unloaded.
5. IO should be measured by putting the pin in a high impedance state and then driving V
OUT
to GND on the following pins: 26-29 and 32.
6. MN/MX is a strap option and should be held to V
CC
or GND.
80C86