參數(shù)資料
型號： IDT89HPES32T8ZHBX
廠商： IDT, Integrated Device Technology Inc
文件頁數(shù)： 9/37頁
文件大?。?/td> 0K
描述： IC PCI SW 32LANE 8PORT 500-SBGA
標準包裝： 27
系列： PRECISE™
類型： PCI Express 開關 - Gen1
應用： 服務器，儲存，通信，嵌入式，消費品
安裝類型： 表面貼裝
封裝/外殼： 500-LBGA
供應商設備封裝： 500-SBGA（31x31）
包裝： 托盤
其它名稱： 89HPES32T8ZHBX
17 of 37
March 25, 2008
IDT 89PES32T8 Data Sheet
Recommended Operating Temperature
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13
(and also listed below).
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
Table 13 (and also listed below).
Thermal Considerations
This section describes thermal considerations for the PES32T8 (31mm2 BXG500 package). The data in Table 16 below contains information that is
relevant to the thermal performance of the PES32T8 switch.
Note: Parameter θJA(eff) is not the absolute thermal resistance for the package as defined by JEDEC (JESD-51). Because resistance can
vary with the number of board layers, size of the board, and airflow, θJA(eff) is the effective thermal resistance. The values for effective θJA
given above are based on a 10-layer, standard height, full length (4.3”x12.2”) PCIe add-in card.
Grade
Temperature
Commercial
0
°C to +70°C Ambient
Table 14 PES32T8 Operating Temperatures
Number of active
Lanes per Port
Core Supply
PCIe Digital
Supply
PCIe Analog
Supply
PCIe Termin-
ation Supply
I/O Supply
Total
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.5V
Max
1.575V
Typ
3.3V
Max
3.6V
Typ
Power
Max
Power
8/8/8/4/4 or
8/8/8/8
mA
888
1014
1499
1660
611
627
763
832
1
4.1W
5.0W
Watts
0.89
1.15
1.5
1.83
0.61
0.69
1.14
1.31
0.004
8/8/4/4/4
mA
800
973
1284
1471
556
590
613
697
1
3.56W
4.4W
Watts
0.8
1.07
1.28
1.61
0.56
0.65
0.92
1.1
0.003
Table 15 PES32T8 Power Consumption
Symbol
Parameter
Value
Units
Conditions
TJ(max)
Junction Temperature
125
oCMaximum
TA(max)
Ambient Temperature
70
oC
Maximum for commercial-rated products
θJA(effective)
Effective Thermal Resistance, Junction-to-Ambient
9.3
oC/W
Zero air flow
7.6
oC/W
1 m/S air flow
6.8
oC/W
2 m/S air flow
θJB
Thermal Resistance, Junction-to-Board
6
oC/W
θJC
Thermal Resistance, Junction-to-Case
0.7
oC/W
P
Power Dissipation of the Device
5.0
Watts
Maximum
Table 16 Thermal Specifications for PES32T8, 31x31 mm BXG500 Package
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參數(shù)描述
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