1-TO-8 LVPECL-" />
參數(shù)資料
型號(hào): ICS87159AGLFT
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 3/17頁(yè)
文件大小: 0K
描述: IC CLOCK GEN 1-8 LVCMOS 56-TSSOP
標(biāo)準(zhǔn)包裝: 1,000
系列: HiPerClockS™
類(lèi)型: 時(shí)鐘發(fā)生器
PLL: 無(wú)
輸入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
輸出: HCSL,LVCMOS,LVTTL
電路數(shù): 1
比率 - 輸入:輸出: 1:9
差分 - 輸入:輸出: 是/是
頻率 - 最大: 600MHz
除法器/乘法器: 是/是
電源電壓: 3.135 V ~ 3.465 V
工作溫度: 0°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 56-TFSOP(0.240",6.10mm 寬)
供應(yīng)商設(shè)備封裝: 56-TSSOP
包裝: 帶卷 (TR)
其它名稱(chēng): 87159AGLFT
87159AG
www.idt.com
REV. B JULY 25, 2010
ICS87159
1-TO-8 LVPECL-TO-HCSL
÷1, ÷2, ÷4 CLOCK GENERATOR
11
Power and Ground
This section provides a layout guide related to power, ground
and placement of bypass capacitors for a high-speed digi-
tal IC. This layout guide is a general recommendation. The
actual board design will depend on the component types
being used, the board density and cost constraints. The
description assumes that the board has clean power and
ground planes. The principle is to minimize the ESR be-
tween the clean power/ground plane and the IC power/
ground pin.
A low ESR bypass capacitor should be used on each power
pin. The value of bypass capacitors ranges from 0.01uF to
0.1uF. The bypass capacitors should be located as close
IC
C
VIA
GND Pin
Power
Pin
GND
Pads
POWER
Pads
FIGURE 4. RECOMMENDED LAYOUT OF BYPASS CAPACITOR PLACEMENT
to the power pin as possible. It is preferable to locate the
bypass capacitor on the same side as the IC. Figure 4 shows
suggested capacitor placement. Placing the by-
pass capacitor on the same side as IC allows the capaci-tor
to have direct contact with the IC power pin. This can avoid
any vias between the bypass capacitor and the IC power
pins.
The vias should be place at the Power/Ground pads. There
should be minimum one via per pin. Increase the number of
vias from the Power/Ground pads to Power/Ground planes
can improve the conductivity.
相關(guān)PDF資料
PDF描述
ICS8731CY-01LF IC CLOCK ULT/ZD BUFFER 48-LQFP
ICS8732AY-01LF IC CLK GEN LV 3.3V LVPECL 52LQFP
ICS87332AMI-01LFT IC CLK GEN ECL/LVPECL 8-SOIC
ICS87354AMILF IC CLK GEN 3.3V LVPECL 8-SOIC
ICS873995AYLF IC ZD/MULT/DIVIDER 48-LQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ICS871S1022EKLF 制造商:Integrated Device Technology Inc 功能描述:IC FEMTOCLOCK LVPE 32VFQFN
ICS871S1022EKLFT 制造商:Integrated Device Technology Inc 功能描述:IC FEMTOCLOCK LVPE 32VFQFN
ICS8725AM-21LF 功能描述:IC CLOCK GEN ZD HSTL 20-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器,PLL,頻率合成器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類(lèi)型:時(shí)鐘/頻率合成器 PLL:無(wú) 輸入:CML,PECL 輸出:CML 電路數(shù):1 比率 - 輸入:輸出:2:1 差分 - 輸入:輸出:是/是 頻率 - 最大:10.7GHz 除法器/乘法器:無(wú)/無(wú) 電源電壓:2.375 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤(pán),16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?(3x3) 包裝:帶卷 (TR) 其它名稱(chēng):SY58052UMGTRSY58052UMGTR-ND
ICS8725AM-21LFT 功能描述:IC CLOCK GEN ZD HSTL 20-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器,PLL,頻率合成器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 類(lèi)型:時(shí)鐘/頻率合成器,扇出分配 PLL:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 除法器/乘法器:- 電源電壓:- 工作溫度:- 安裝類(lèi)型:表面貼裝 封裝/外殼:56-VFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:56-VFQFP-EP(8x8) 包裝:帶卷 (TR) 其它名稱(chēng):844S012AKI-01LFT
ICS8725AY-01LF 功能描述:IC CLK GEN ZD 2:5 HSTL 32-LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器,PLL,頻率合成器 系列:HiPerClockS™ 產(chǎn)品變化通告:Product Discontinuation 04/May/2011 標(biāo)準(zhǔn)包裝:96 系列:- 類(lèi)型:時(shí)鐘倍頻器,零延遲緩沖器 PLL:帶旁路 輸入:LVTTL 輸出:LVTTL 電路數(shù):1 比率 - 輸入:輸出:1:8 差分 - 輸入:輸出:無(wú)/無(wú) 頻率 - 最大:133.3MHz 除法器/乘法器:是/無(wú) 電源電壓:3 V ~ 3.6 V 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:16-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:管件 其它名稱(chēng):23S08-5HPGG