Internet Data Sheet
Rev. 1.0, 2007-03
03292007-RHOW-C5L6
4
HYS72T[512/1G]0x2EP–[3S/3.7]–B
Registerd DDR2 SDRAM Module
1.2
Description
The Qimonda HYS72T512022EP–[3S/3.7]–B module family
are Registered DIMM (with parity) modules with 30 mm height
based on DDR2 technology.
DIMMs are available as ECC modules in 512M
×
72 (4 GB)
organization and density, intended for mounting into 240-Pin
connector sockets.
The memory array is designed with 1-Gbit Double-Data-Rate-
Two (DDR2) Synchronous DRAMs. All control and address
signals are re-driven on the DIMM using register devices and
a PLL for the clock distribution. This reduces capacitive
loading to the system bus, but adds one cycle to the SDRAM
timing. Decoupling capacitors are mounted on the PCB
board. The DIMMs feature serial presence detect based on a
serial E
2
PROM device using the 2-pin I
2
C protocol. The first
128 bytes are programmed with configuration data and the
second 128 bytes are available to the customer.
TABLE 1
Ordering Information for RoHS Compliant Products
TABLE 2
Address Format Table
TABLE 3
Components on Modules
Product Type
1)
1) All Product Type number end with a place code, designating the silicon die revision. Example: HYS72T512022EP–3.7–B, indicating Rev.
“B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see
Chapter 6
of this data
sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200R–444–12–F0”, where 4200P
means Registered DIMM modules (with Parity Bit) with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address Strobe
(CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2
and produced on the Raw Card “F”
Compliance Code
2)
Description
SDRAM
Technology
PC2–4200
HYS72T512022EP–3.7–B
PC2–5300
HYS72T512022EP–3S–B
4 GB 2R
×
4 PC2–4200P–444–12–K0
2 Ranks, ECC
2
×
256 Mbit (
×
4)
4 GB 2R
×
4 PC2–5300P–555–12–K0
2 Ranks, ECC
2
×
256 Mbit (
×
4)
DIMM
Density
Module
Organization
Memory
Ranks
ECC/
Non-ECC
# of SDRAMs # of row/bank/column
bits
Raw
Card
4 GByte
512M
×
72
2
ECC
36
14/3/11
K
Product Type
1)
1) Green Product
2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
DRAM Components
1)2)
DRAM Density
DRAM Organisation
HYS72T512022ER
HYB18T2G402BF
2 × 1 Gbit
2
×
256M
×
4