Internet Data Sheet
Rev. 1.42, 2007-01
03292006-7CZA-YS85
20
HYS72D[64/128/256]xxx[G/H]BR–[5/6/7]–B
Registered DDR SDRAM Module
Data-out low-impedance time
from CK/CK
Mode register set command cycle
time
DQ/DQS output hold time from
DQS
Data hold skew factor
Active to Autoprecharge delay
Active to Precharge command
Active to Active/Auto-refresh
command period
Active to Read or Write delay
Average Periodic Refresh Interval
t
REFI
Auto-refresh to Active/Auto-
refresh command period
Precharge command period
Read preamble
Read postamble
Active bank A to Active bank B
command
Write preamble
Write preamble setup time
Write postamble
Write recovery time
Internal write to read command
delay
Exit self-refresh to non-read
command
Exit self-refresh to read command
t
XSRD
1) 0
°
C
≤
T
A
≤
70
°
C
; V
DDQ
= 2.5 V
±
0.2 V,
V
DD
= +2.5 V
±
0.2 V (DDR333);
V
DDQ
= 2.6 V
±
0.1 V,
V
DD
= +2.6 V
±
0.1 V (DDR400)
2) Input slew rate
≥
1 V/ns for DDR400, DDR333
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference level for signals
other than CK/CK, is
V
REF
. CK/CK slew rate are
≥
1.0 V/ns.
4) Inputs are not recognized as valid until
V
REF
stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is
V
TT
.
6) For each of the terms, if not already an integer, round to the next highest integer.
t
CK
is equal to the actual system clock cycle time.
7)
t
and
t
transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a specific
voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) Fast slew rate
≥
1.0 V/ns , slow slew rate
≥
0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/ns, measured
between
V
IH(ac)
and
V
IL(ac)
.
9) These parameters guarantee device timing, but they are not necessarily tested on each device.
10) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
t
LZ
–0.7
+0.7
–0.7
+0.7
ns
2)3)4)5)7)
t
MRD
2
—
2
—
t
CK
2)3)4)5)
t
QH
t
HP
–
t
QHS
—
t
HP
–
t
QHS
—
ns
2)3)4)5)
t
QHS
t
RAP
t
RAS
t
RC
—
t
RCD
40
55
+0.50
—
70E+3
—
—
t
RCD
42
60
+0.50
—
70E+3
—
ns
ns
ns
ns
TFBGA
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
t
RCD
15
—
65
—
7.8
—
18
—
72
—
7.8
—
ns
μ
s
ns
2)3)4)5)
2)3)4)5)10)
t
RFC
2)3)4)5)
t
RP
t
RPRE
RPST
t
RRD
15
0.9
0.40
10
—
1.1
0.60
—
18
0.9
0.40
12
—
1.1
0.60
—
ns
t
CK
t
CK
ns
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
t
WPRE
t
WPRES
t
WPST
t
WR
t
WTR
0.25
0
0.40
15
2
—
—
0.60
—
—
0.25
0
0.40
15
1
—
—
0.60
—
—
t
CK
ns
t
CK
ns
t
CK
2)3)4)5)
2)3)4)5)11)
2)3)4)5)12)
2)3)4)5)
2)3)4)5)
t
XSNR
75
—
75
—
ns
2)3)4)5)
200
—
200
—
t
CK
2)3)4)5)
Parameter
Symbol
–5
–6
Unit
Note/ Test
Condition
1)
DDR400B
DDR333
Min.
Max.
Min.
Max.