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參數(shù)資料
| 型號： | HW125F |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 4/16頁 |
| 文件大?。?/td> | 373K |
| 代理商： | HW125F |
4
Lucent Technologies Inc.
HW125F Power Modules; dc-dc Converters:
36 Vdc to 75 Vdc Input, 3.3 Vdc Output; 83.5 W
Data Sheet
August 2000
General Specifications
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Remote On/Off Signal Interface
(V
I
= 0 V to 75 V; open collector or equivalent
compatible; signal referenced to V
I
(–) terminal; see
Figure 12 and Feature Descriptions.):
HW125x1 Preferred Logic:
Logic Low—Module On
Logic High—Module Off
HW125x Optional Logic:
Logic Low—Module Off
Logic High—Module On
Logic Low:
At I
on/off
= 1.0 mA
At V
on/off
= 0.0 V
Logic High:
At I
on/off
= 0.0
μ
A
Leakage Current
Turn-on Time (I
O
= 80% of I
O, max
; V
O
within
±
1% of
steady state; see Figure 8.)
Output Voltage Adjustment
(See Feature Descriptions.):
Output Voltage Remote-sense Range
Output Voltage Set-point Adjustment Range (trim)
Output Overvoltage Protection
* These are manufacturing test limits. In some situations, results may differ.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet the solder ball requirements per J-STD-001B. These
requirements state that solder balls must neither be loose nor violate the power module minimum electrical spacing.
The cleanliness designator of the open frame power module is C00 (per J specification).
For cleaning process, refer to Lucent Technologies
cation Note (AP97-021EPS).
Board-Mounted Power Modules: Soldering and Cleaning
Appli-
Parameter
= 80% of I
O, max
; T
A
= 20
°
C)
Min
Typ
Max
Unit
hours
g (oz.)
Calculated MTBF (I
Weight
O
3,266,000
—
—
50 (1.8)
Symbol
Min
Typ
Max
Unit
V
on/off
I
on/off
V
on/off
I
on/off
—
0
—
—
—
10
—
—
—
—
30
1.2
1.0
15
50
50*
V
mA
V
μ
A
ms
—
—
—
90
4.0*
—
—
—
0.5
110
5.5*
V
%V
O, nom
V
V
O, sd
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