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參數(shù)資料
| 型號(hào)： | HT1MOA2S30 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類(lèi)： | 通信及網(wǎng)絡(luò) |
| 英文描述： | HITAG 1 transponder IC |
| 封裝： | HT1ICS3002W/V6F<Uncased die|<<<1<Always Pb-free,;HT1ICS3002W/V6F<Uncased die|<<<1<Always Pb-free,;HT1MOA2S30/E/3<SOT500|<<<1<Always Pb-free,; |
| 文件頁(yè)數(shù)： | 1/9頁(yè) |
| 文件大小： | 75K |
| 代理商： | HT1MOA2S30 |
1. General description
HITAG 1 based transponders are highly integrated and do not need any additional
components beside the external coil.
Data between Key (RWD) and transponder is transmitted bidirectionally, in Half Duplex
Mode. The HITAG 1 transponder IC offers also an encrypted data transmission.
The AntiCollision (AC) Mode, which is used mainly in long range operation, allows to
handle several transponders that are at the same time in the communication field of the
antenna, thus achieving highest operating reliability and permitting to handle several
transponders quickly and simultaneously.
The HITAG 1 transponder IC provides two protocol modes, Standard and Advanced
Mode. The Advanced Protocol Mode operates compared to the Standard Protocol Mode
with an increased number of Startbits and a 8-bit Cyclic Redundancy Check (CRC) sent
by the transponder IC at read operations.
HITAG 1 transponder IC offer a memory of 2 kbit.
2.
Features and benefits
Identification transponder for use in contactless applications
Operating frequency 125 kHz
Data transmission and energy supply via RF link, no internal battery
Non-volatile memory of 2 kbit
Organized in 64 pages, 4 bytes each
10 years non-volatile data retention
100000 erase/write cycles
Selective read/write protection of memory content
Mutual authentication function
3. Applications
Logistics
Asset tracking
Gas cylinder ID
Industrial automation
HT1x
HITAG 1 transponder IC
Rev. 3.0 — 16 September 2011
210530
Product short data sheet
COMPANY PUBLIC
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HT1MOA2S30/E/3,118 | 功能描述:RFID應(yīng)答器 HITAG 1 MOA2 MODULE RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| HT1MOA3S30 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:HITAGTM1 Chip Module |
| HT1MOA3S30/E/1 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:HITAGTM1 Chip Module |
| HT1MOA3S30/E/3 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:HITAGTM1 Chip Module |
| HT1TA | 功能描述:兩極晶體管 - BJT - RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
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