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參數資料
| 型號： | HSDL-3600 |
| 英文描述： | RES THICK FILM POWER 30 OHM 25W |
| 中文描述： | 紅外符合4 Mb / s的3伏紅外線收發(fā)器 |
| 文件頁數： | 25/34頁 |
| 文件大?。?/td> | 567K |
| 代理商： | HSDL-3600 |
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25
See Fig 4.0
t, nominal stencil thickness
mm
0.152
0.127
w
, the width of aperture is fixed at 0.60 mm (0.024 inches)
Aperture opening for shield pad is 5.7 mm x 1.6 mm as per land dimensions
l, length of aperture
mm
3.1
±
0.05
3.7
±
0.05
inches
0.006
0.005
inches
0.122
±
0.002
0.147
±
0.002
2.1 Recommended Metal
Solder Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
Figure 4.0. Solder Paste Stencil Aperture.
Allowable Misalignment Tolerance
X – direction
≤
0.2 mm (0.008 inches)
3.0 Pick and Place
Misalignment Tolerance and
Product Self-Alignment after
Solder Reflow
If the printed solder paste volume
is adequate,
the unit will self-
align
in X-direction after solder
reflow. Units should be properly
reflowed in IR Hot Air convection
oven using the recommended
reflow profile. The direction of
board travel does not matter.
APERTURE AS PER
LAND DIMENSIONS
SOLDER
PASTE
l
w
t (STENCIL THICKNESS)
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| HSDL-3612-008 | IrDA Data Compliant 115.2kb/s 3V to 5V Infrared Transceiver |
| HSDL-3612-037 | IrDA Data Compliant 115.2kb/s 3V to 5V Infrared Transceiver |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| HSDL-3600#007 | 制造商:Hewlett Packard Co 功能描述:SPECIALTY INTERFACE CIRCUIT, SMA10 |
| HSDL-3600#008 | 制造商:Hewlett Packard Co 功能描述:SPECIALTY INTERFACE CIRCUIT, SMA10 |
| HSDL-3600#017 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FIBER OPTIC TRANSCEIVER |
| HSDL-3600#018 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FIBER OPTIC TRANSCEIVER |
| HSDL3600008 | 制造商:AGILENT 功能描述:NEW |
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