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參數(shù)資料
| 型號(hào)： | HMMC-5620 |
| 元件分類(lèi)： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 0.0555 X 0.0397 INCH, DIE |
| 文件頁(yè)數(shù)： | 2/8頁(yè) |
| 文件大?。?/td> | 178K |
| 代理商： | HMMC-5620 |
2
DC Specifications/Physical Properties[1]
1. Measured in wafer form with Tchuck = 25°C. (Except θch-bs).
Symbol
Parameters/Conditions
Min.
Typ.
Max.
Units
IDD
Drain Current (VDD = + 5.0 volts)
70
100
135
mA
IDD
Drain Current (VDD = + 7.0 volts)
105
mA
θch-bs
Thermal Resistance (Tbackside = 25°C)
70
°C/W
Notes:
RF Specifications/Physical Properties
(VDD = 5.0V, IDD(Q) = 100mA, Zin = Zo = 50)[1]
Symbol
Parameters/Conditions
6.0–20 GHz
Min.
Typ.
Max.
Units
BW
Guaranteed Bandwidth
6
20
GHz
S21
Small Signal Gain
15
17
21
dB
S21
Small Signal Gain Flatness
±1.0
±1.25
dB
RLin
Input Return Loss
15
10
dB
RLout
Output Return Loss
15
10
dB
S12
Reverse Isolation
55
dB
P1dB
Output Power at 1dB Gain Compression
12
dBm
Psat
Saturated Output Power
13
dBm
H2
Second Harmonic, (6 <0<20)(P0(0) = 10 dBm)
30
dBc
H3
Third Harmonic, (6 <0<20)(P0(0) = 10 dBm)
40
dBc
NF
Noise Figure
9.0
dB
Notes:
1. Small-signal data measured in wafer form with Tchuck = 25°C. Large–signal data measured on individual devices mounted in an Agilent 83040 Series
Modular Microcircuit Package @ TA = 25°C.
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